INA226
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High-or Low-Side Measurement,
Bi-Directional CURRENT/POWER MONITOR with I2C™Interface
Check for Samples:INA226
FEATURES DESCRIPTION
The INA226is a current shunt and power monitor •SENSES BUS VOLTAGES FROM0V TO+36V
with an I2C interface.The INA226monitors both a •HIGH-OR LOW-SIDE SENSING
shunt voltage drop and bus supply voltage.•REPORTS CURRENT,VOLTAGE,AND POWER Programmable calibration value,conversion times,
•HIGH ACCURACY:and averaging,combined with an internal multiplier,
enable direct readouts of current in amperes and –0.1%Gain Error(Max)
power in watts.
–10μV Offset(Max)
•CONFIGURABLE AVERAGING OPTIONS The INA226senses current on buses that can vary
from0V to+36V,while the device obtains its power •16PROGRAMMABLE ADDRESSES
from a single+2.7V to+5.5V supply,drawing a •OPERATES FROM2.7to5.5V POWER SUPPLY
typical of330μA of supply current.The INA226is •MSOP-10PACKAGE specified over the operating temperature range
of–40°C to+125°C.The I2C interface features16 APPLICATIONS programmable addresses.
•SERVERS
RELATED PRODUCTS •TELECOM EQUIPMENT
DESCRIPTION DEVICE •COMPUTERS
Current/Power Monitor with Watchdog,Peak-Hold,
INA209•POWER MANAGEMENT and Fast Comparator Functions
•BATTERY CHARGERS INA210,INA211,
Zerø-Drift,Low-Cost,Analog Current Shunt Monitor
INA212,INA213,
Series in Small Package
•POWER SUPPLIES
INA214•TEST EQUIPMENT Zerø-Drift,Bi-Directional Current Power Monitor with
INA219
Two-Wire Interface
High or Low Side,Bi-Directional Current/Power
INA220
Monitor with Two-Wire Interface
High-or Low-Side Sensing
Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
trademark of NXP Semiconductors.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.Copyright©2011,Texas Instruments Incorporated Products conform to specifications per the terms of the Texas
Instruments standard warranty.Production processing does not
necessarily include testing of all parameters.
INA226
SBOS547–JUNE2011www.ti This integrated circuit can be damaged by ESD.Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions.Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure.Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGING INFORMATION(1)
PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING
INA226AIDGS MSOP-10DGS226
(1)For the most current package and ordering information see the Package Option Addendum at the end of this document,or see the
INA226product folder at www.ti.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range(unless otherwise noted).
INA226UNIT Supply Voltage,V S6V Differential(VIN+)–(VIN–)(2)–40to+40V
Analog Inputs,
VIN+,VIN–Common-Mode–0.3to+40V
SDA GND–0.3to+6V
SCL GND–0.3to V S+0.3V
Input Current Into Any Pin5mA
Open-Drain Digital Output Current10mA Storage Temperature–65to+150°C Junction Temperature+150°C Human Body Model(HBM)2500V
ESD Ratings Charged-Device Model(CDM)1000V Machine Model(MM)150V
(1)Stresses above these ratings may cause permanent damage.Exposure to absolute maximum conditions for extended periods may
degrade device reliability.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those specified is not implied.
(2)VIN+and VIN–may have a differential voltage of–40V to+40V;however,the voltage at these pins must not exceed the range–0.3V to
+40V.
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INA226
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ELECTRICAL CHARACTERISTICS:V S=+3.3V
Boldface limits apply over the specified temperature range,T A=–40°C to+125°C.
At T A=+25°C,VIN+=12V,V SENSE=(VIN+–VIN–)=0mV,V BUS=12V,unless otherwise noted.
INA226
PARAMETER CONDITIONS MIN TYP MAX UNIT INPUT
Shunt voltage input range-81.917581.92mV
Bus voltage input range(1)036V Common-mode rejection CMRR V IN+=0V to+36V126140dB Shunt offset voltage,RTI(2)V OS±2.5±10μV vs Temperature0.020.1μV/°C vs Power supply PSRR V S=+2.7V to+5.5V  2.5μV/V Bus offset voltage,RTI(2)V OS±1.25±7.5mV vs Temperature1040μV/°C vs Power supply PSRR0.5mV/V Input bias current I IN+,I IN-10μA
V BUS input impedance830kΩ
(VIN+Pin)+(VIN–Pin),
Input leakage(3)0.10.5μA
Power-down mode
DC ACCURACY
ADC native resolution16Bits
1LSB step size Shunt voltage  2.5μV
Bus voltage  1.25mV Shunt voltage gain error0.020.1% vs Temperature1050ppm/°C Bus voltage gain error0.020.1% vs Temperature1050ppm/°C Differential nonlinearity±0.1LSB ADC conversion time CT bit=000140154μs
CT bit=001204224μs
CT bit=010332365μs
CT bit=011588646μs
CT bit=100  1.1  1.21ms
CT bit=101  2.116  2.328ms
CT bit=110  4.156  4.572ms
CT bit=1118.2449.068ms SMBus
SMBus timeout(4)2835ms DIGITAL INPUT/OUTPUT
Input capacitance3pF Leakage input current0≤V IN≤V S0.11μA Input logic levels:
V IH0.7(V S)6V V IL–0.50.3(V S)V Output logic level
V OL SDA,alert I OL=3mA00.4V Hysteresis500mV (1)While the input range is36V,the full-scale range of the ADC scaling is40.96V.See the Basic ADC Functions section.Do not apply
more than36V.
(2)RTI=Referred-to-input.
(3)Input leakage is positive(current flowing into the pin)for the conditions shown at the top of this table.Negative leakage currents can
occur under different input conditions.
(4)SMBus timeout in the INA226resets the interface any time SCL is low for more than28ms.
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INA226
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ELECTRICAL CHARACTERISTICS:V S=+3.3V(continued)
Boldface limits apply over the specified temperature range,T A=–40°C to+125°C.
At T A=+25°C,VIN+=12V,V SENSE=(VIN+–VIN–)=0mV,V BUS=12V,unless otherwise noted.
degradeINA226
PARAMETER CONDITIONS MIN TYP MAX UNIT POWER SUPPLY
Operating supply range+2.7+5.5V Quiescent current330420μA Quiescent current,power-down mode0.52μA Power-on reset threshold2V TEMPERATURE RANGE
Specified range–40+125°C
THERMAL INFORMATION
INA226
THERMAL METRIC(1)DGS UNITS
10PINS
θJA Junction-to-ambient thermal resistance171.4
θJCtop Junction-to-case(top)thermal resistance42.9
θJB Junction-to-board thermal resistance91.8
°C/W
ψJT Junction-to-top characterization parameter  1.5
ψJB Junction-to-board characterization parameter90.2
θJCbot Junction-to-case(bottom)thermal resistance n/a
(1)For more information about traditional and new thermal metrics,see the IC Package Thermal Metrics application report,SPRA953.
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GND V S+
V BUS SCL
12345
109876
A1A0SDA Alert VIN+VIN -
Shunt Voltage
Channel Bus Voltage
Channel
INA226
www.ti
SBOS547–JUNE 2011
PIN CONFIGURATIONS
DGS PACKAGE
MSOP-10(Top View)
PIN DESCRIPTIONS
MSOP-10(DGS)
PIN NO NAME DESCRIPTION
1A1Address pin.Connect to GND,SCL,SDA,or V S .Table 7shows pin settings and corresponding addresses.2A0Address pin.Connect to GND,SCL,SDA,or V S .Table 7shows pin settings and corresponding addresses.3Alert Multi-functional alert,open-drain output.4SDA Serial bus data line,open-drain input/output.5SCL Serial bus clock line,open-drain input.6V S+Power supply,2.7V to 5.5V.7GND Ground.
8V BUS Bus voltage input.
9VIN –Negative differential shunt voltage.Connect to negative side of shunt resistor.10
VIN+
Positive differential shunt voltage.Connect to positive side of shunt resistor.
REGISTER BLOCK DIAGRAM
(1)Read-only (2)
Read/write
Figure 1.INA226Register Block Diagram
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