IPC-1601 PRINTED CIRCUIT BOARD HANDLING AND STORAGE
GUIDELINES
Strawman Draft – September 2007
1 INTRODUCTION
1.1 Background Historically, the printed circuit board (pcb) industry relied on military specifications and guidelines to define packaging methods to preserve the quality and reliability of pcbs and assemblies during shipment and storage. Most of these specifications and guidelines are now irrelevant, obsolete or outdated, leaving the industry without any currently effective guidelines. Additionally, the proliferation of new alternative final finishes has produced new concerns and needs. Overwhelming attendance at a panel discussion held at the IPC Fall Works meeting in Minneapolis in 2004 produced many requests to develop a guideline that our industry could use to achieve effective handling, packaging, and storage practices. This guideline is the result of those inputs.
1.2 Purpose This guideline is intended to provide useful information on handling, packaging materials, environmental conditions and storage methods, for pcbs and assemblies. The scope of coverage will b
e from the manufacture of the bare pcb all the way to possible return of the assembled pcb for warranty repair. As a guideline, this information is to be used with, and is secondary to, established requirements in such documents as the IPC-455X (a series of documents for alternate final finishes) series of documents. Effective use of this guideline should  prevent damage and maintain reliability of pcbs and assemblies.
1.3 Target Audience The target audience includes all phases of pcb design, manufacture, assembly, shipping, storage, and possible warranty activities. Resources for this information include all of these functions, as well as the material and equipment suppliers.
1.4 Terms and Definitions The definition of all terms used herein shall be as specified in IPC-T-50 and as defined below.
2 APPLICABLE DOCUMENTS
2.1 IPC
IPC-T-50
3 BOARD FABRICATION AND PACKAGING (HANDLING)
3.1 Board Materials All materials used in the manufacturing of printed boards must be protected from environmental, handling and storage damage. It is customary for manufacturers to have FOD procedures( spell out)ISO, OEM flow down to suppliers in place that outline these preventive practices. Primary areas of concern for printed board materials are:
3.1.1 Bonding materials, pre-preg and foils
3.1.1.1 Environmental concerns These materials are sensitive to damage from exposure to moisture and humidity. They must have a degree of protection starting from material manufacture and storage, through transportation to the using facility, and within the using facility. Typically, these materials are stored and used in a controlled environment where the temperature and humidity controlled within limits specified by the manufacturers of these materials. The normal ranges are XX-XX % humidity and XX-XX temperature. Temperature and humidity recorders are a normal part of the control process for the storage and use locations, and may also be used during the transportation of these materials. Please refer to your material manufacturer’s recommendations for guidance on your materials.
3.1.1.2 Handling and processing concerns  The infrastructure of the manufacturing location, as well a
s the equipment used to manufacture these materials, must be designed and evaluated to provide protection from damage and the introduction of foreign materials that may be detrimental to the finished product. Boxes, trays, and carts can be designed to protect these materials during transportation and use. Processing equipment must be evaluated to assure that it is capable of processing these materials reliably without causing damage to these materials or the finished product.
3.2 INNER LAYER PRODUCTION CONCERNS
3.2.1 Photo tooling
3.2.1.1 Temperature and Humidity The temperature and humidity in the area that the photo tools are used and stored must be in the same ranges that the area that the photo tools are manufactured. This will ensure that the scaling of the imaged product matches the intended scaling of the photo tooling. Temperature and humidity recorders are typically used in these areas to assist in controlling this environment.
3.2.1.2 Handling and Storage Photo tools are usually placed into protective envelopes, and stored in a manner that provides a reasonable amount of air movement around the photo tool to prevent entra
pment of moisture. This moisture may degrade the photo tool prematurely. These protective envelopes also provide protection from abrasion and the introduction of foreign materials. Protective carriers may be designed to protect photo tools during transportation from the manufacturing area to the area of use where this transportation is required.
3.2.2 Process Equipment
3.2.2.1 Capability Equipment used for processing inner layers must be designed for  handling the inner layer sizes, thicknesses, and material types used. Processing equipment must be verified capable of processing these materials without incurring damage.
3.2.2.2Preventive Maintenance A preventive maintenance program should be developed and implemented to prevent the equipment from becoming in-capable of processing product reliably.
3.3 Handling of the Finished Board- Assignee- Tom Kemp- Rockwell (Vegas)
3.3.1 Handling during sub-processes (between facilities)
3.3.2 Marking of the Board
3.3.3 Handling for Bare Board Test
3.3.4 ESD (Embedded Components?)
3.3.5 Customer Returns
4 Marking – Bare Board and/Or Packaging- Assignee- Joe Kane- BAE
4.1 Lead Free/ RoHS compliance
Where required by statute or by the user, packaging shall be marked in accordance with RoHS Directive 2002/95/EC, with exceptions noted in the Annex, or other applicable statutes.  This applies to PCB’s that only contain permissible levels of lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls, and polybrominated diphenyl ethers.
A suitable identification symbol such as the following may be used on packaging or packaging labels:
Where required by the user, surface finish and other attributes of PCB’s and packaging shall be marked in accordance with J-STD-609.
4.2 ESD
Packaging for ESD-sensitive PCB’s shall be marked per ANSI/ESD S20.20, including the ESD protective symbol:
S8.1
EOS/ESD
Symbol
Protective
4.3 Moisture
PCB’s enclosed in dry packaging may be marked with a suitable warning or moisture sensitivity caution symbol in a similar fashion to the marking requirements of J-STD-033:
Moisture
Caution
Sensitivity
Symbol
4.4 Not greater than 97% Tin:
PCB’s that include tin (Sn) plating that is more than 97% pure tin may be at risk for developing tin whiskers.  Where required by the user, packaging may include a suitable warning, such as the following:
Note that tin finishes containing more than 97% tin may be considered “pure” according to some military or industry specifications for the purpose of assessing the risk of tin whisker growth, but this definition does not necessarily assure compliance with the RoHS Directive (see Paragraph 4.1).
4.5 Other markings
Other markings (e.g. date codes, U.L.) shall be as specified by the user.
Referenced Documents: (Move to Section 2.0?)
ANSI/ESD S20.20 Protection of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrically Initiated Explosive Devices)
Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS Directive)
EOS/ESD S8.1 Protection of Electrostatic Discharge Susceptible Items - Symbols - ESD Awareness
IPC/JEDEC J-STD-033 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
J-STD-609 Marking and Labeling of Components, PCBs and PCBAs to Identify Lead, Lead Free and Other Attributes
5 Shipment of Bare Board – Assignee- Mike Paddack- Boeing
5.1 Marking of the Package
5.2 Packaging Materials/Testing (Bags, Seal Test of Bags, etc.)
5.3 Packaging Methods
5.3.1 Rigid Boards
5.3.2 Flexible Boards (Fixturing)
5.3.3 Board Cleanliness
5.3.4 Baking
5.3.4.1 Time
5.3.4.2 Temperature
5.3.4.3 Use Life
5.3.4.4 Use of Vacuum
5.3.5 Customer Returns
6 Storage Prior to Assembly– Assignee- Don Youngblood- Honeywell
6.1 Storage Conditions (Temperature, Humidity, Atmosphere)
6.1.1 Storage Containers
6.1.2 Storage Location
6.1.3 Shelf Life
6.1.4 Desiccant/Humidity Indicators (Bag Size, Number Required, etc.)
7 Assembly Processes
7.1 Handling Prior to Assembly – Assignee- Dave Hillman-Rockwell Collins
7.1.1 Board Type Considerations
degrade
7.1.2 Surface Finish Considerations
7.2 Handling during Assembly
7.2.1 Equipment Considerations
Printers
Consideration of stress, strain and ESD must be maintained at the same time as that of cleanliness.  The printer and its associated stencils must be cleaned so that neither fresh solder paste or dried, old paste are deposited where not required/needed.  The preventative maintenance (PM) schedule of the machine should be such that there is no danger of machine oils or greases coming in contact with the printed circuit board; the solder paste; stencil; support blocks, pins, grid, or plates (depending upon the machine type); or stencil cleaning equipment/cloth.
The placement of the supporting accessories in the printer must be such as to prevent board warpage and subsequent solder paste bleed on application.  The pressure of the squeegee must be such as to not exacerbate the situation.

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