汽车电子系统中英文对照外文翻译文献汽车电子系统中英文对照外文翻译文献
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汽车电子系统中英文对照外文翻译文献
(文档含英文原文和中文翻译)
The Changing Automotive Environment: High-Temperature Electronics
R. Wayne Johnson, Fellow, IEEE, John L. Evans, Peter Jacobsen, James R. (Rick) Thompson, and Mark Christopher
Abstract —The underhood automotive environment is harsh and current trends in the automotive electronics industry will be pushing the temperature
envelope for electronic components. The desire to place engine control units
on the engine and transmission control units either on or in the transmission
will push the ambient temperature above 125125℃℃.
However, extreme cost pressures,increasing reliability demands (10 year/241 350 km) and the cost of field failures (recalls, liability, customer loyalty) will make the shift to higher temperatures occur incrementally. The coolest spots on engine and in the transmission will be used. These large bodies do provide considerable
heat sinking to reduce temperature rise due to power dissipation in the control
unit. The majority of near term applications will be at 150 ℃ or less and
these will be worst case temperatures, not nominal. The transition to
X-by-wire technology, replacing mechanical and hydraulic systems with electromechanical systems will require more power electronics. Integration
of power transistors and smart power devices into the electromechanical
℃  to 200
℃ . Hybrid
actuator will require power devices to operate at 175
electric vehicles and fuel cell vehicles will also drive the demand for higher temperature power electronics. In the case of hybrid electric and fuel cell vehicles, the high temperature will be due to power dissipation. The
alternates to high-temperature devices are thermal management systems which add weight and cost. Finally, the number of sensors in vehicles is increasing
as more electrically controlled systems are added. Many of these sensors must
work in high-temperature environments. The harshest applications are exhaust
gas sensors and cylinder pressure or combustion sensors. High-temperature electronics use in automotive systems will continue to grow, but it will be gradual as cost and reliability issues are addressed. This paper examines the
motivation for higher temperature operation,the packaging limitations even
at 125 C with newer package styles and concludes with a review of challenge at both the semiconductor device and packaging level as temperatures push beyond 125 ℃.
Index Terms—Automotive, extreme-environment electronics.
I. INTRODUCTION
I N 1977, the average automobile contained $110 worth of electronics [1]. By 2003 the electronics content was $1510 per vehicle and is expected to reach
$2285 in 2013 [2].The turning point in automotive electronics was government
TABLE I
MAJOR AUTOMOTIVE ELECTRONIC SYSTEMS
TABLE II
AUTOMOTIVETEMPERATUREEXTREMES(DELPHIDELCOELECTRONIC SYSTEMS) [3]
controller翻译中文
regulation in the 1970s mandating emissions control and fuel economy. The complex fuel control required could not be accomplished using traditional mechanical systems. These government regulations coupled with increasing semiconductor computing power at decreasing cost have led to an ever increasing array of automotive electronics. Automotive electronics can be divided into five major categories as shown in Table I.
The operating temperature of the electronics is a function of location, power dissipation by the electronics, and the thermal design. The automotive electronics industry defines high-temperature electronics as electronics operating above 125 ℃. However, the actual temperature for various electronics mounting locations varies considerably. Delphi Delco Electronic Systems recently published the typical continuous maximum temperatures as reproduced in Table II [3]. The corresponding underhood temperatures are shown in Fig. 1. The authors note that typical junction temperatures for integrated circuits are 10 ℃to15℃ higher than ambient or baseplate temperature, while power devices can reach 25 ℃ higher. At-engine temperatures of 125℃ peak can be maintained by placing the electronics on the
intake manifold.
Fig. 1. Engine compartment thermal profile (Delphi Delco Electronic Systems) [3].
TABLE III THEAUTOMOTIVEENVIRONMENT(GENERALMOTORS ANDDELPHIDELCO ELECTRONICSYSTEMS) [4]
TABLE IV REQUIREDOPERATIONTEMPERATURE FORAUTOMOTIVEELECTRONIC SYSTEMS(TOYOTAMOTORCORP. [5]
TABLE V
MECHA TRONICMAXIMUMTEMPERA TURERANGES(DAIMLERCHRYSLER,EA TONCORPORA TION, ANDAUBURNUNIVERSITY) [6]
Fig. 2. Automotive temperatures and related systems (DaimlerChrysler) [8].
automotive electronic systems [8]. Fig. 3 shows an actual measured transmission transmission temperature temperature temperature profile profile profile during during during normal normal normal and and excessive excessive driving driving
conditions [8]. Power braking is a commonly used test condition where the brakes are applied and the engine is revved with the transmission in gear.
A similar real-world situation would be applying throttle with the emergency
brake applied. Note that when the temperature reached 135135℃℃,
the over temperature light came on and at the peak temperature of 145145℃℃,
the transmission was beginning to smell of burnt transmission fluid.

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