pcb正负片工艺流程
    英文回答：
    PCB (Printed Circuit Board) manufacturing involves several steps in the positive and negative process flow. These steps are crucial in creating the desired circuitry on the PCB. Let me explain the process in detail.
    The positive process flow starts with a copper-clad laminate sheet. The first step is to clean the laminate surface to remove any dirt or contaminants. This is usually done using a cleaning solution.
    After cleaning, a photosensitive dry film is applied to the laminate surface. The dry film is then exposed to UV light through a photomask, which contains the desired circuit pattern. The UV light hardens the exposed areas of the film, while the unexposed areas remain soft.
    Next, the unexposed areas of the dry film are washed away using a developing solution, revealing the copper surface underneath. The exposed copper areas now form the circuit pat
tern.
    The next step is to etch away the unwanted copper from the laminate surface. This is done by immersing the PCB in an etching solution, usually an acid. The acid dissolves the exposed copper, leaving behind only the circuit pattern.
    Once the etching is complete, the remaining dry film is stripped off, leaving the circuit pattern on the laminate surface. The PCB is then cleaned again to remove any residual etching solution or dry film residue.
    In the negative process flow, the steps are slightly different. Instead of applying a dry film, a photosensitive liquid resist is used. The liquid resist is applied to the laminate surface and then exposed to UV light through a photomask. The exposed areas of the resist polymerize and become insoluble, while the unexposed areas remain soluble.
    After exposure, the unexposed areas of the liquid resist are washed away using a developing solution. The exposed copper areas are now protected by the hardened resist.
    The next step is to plate the exposed copper areas with a layer of tin or other protective metal. This is done by immersing the PCB in an electroplating bath. The metal ions in the bath are attracted to the exposed copper, forming a protective layer.
    Once the plating is complete, the resist is stripped off, leaving the protected circuit pattern. The PCB is then cleaned to remove any residual plating solution or resist residue.
    中文回答：
    PCB（Printed Circuit Board）制造涉及到正片和负片工艺流程中的几个步骤。这些步骤对于在PCB上创建所需的电路非常重要。让我详细解释一下这个过程。
    正片工艺流程从铜包覆层压板开始。首先，要清洁层压板表面，去除任何污垢或杂质。通常使用清洁溶液进行清洁。
    清洁后，在层压板表面涂上一层光敏干膜。然后，通过光掩膜对干膜进行紫外线曝光，光掩膜上包含了所需的电路图案。紫外线使干膜中的曝光区域硬化，而未曝光区域保持软化。
    接下来，使用显影溶液冲洗掉未曝光区域的干膜，露出铜表面。曝光的铜区域现在形成了电路图案。
    下一步是从层压板表面腐蚀掉不需要的铜。这是通过将PCB浸入腐蚀溶液（通常是酸）中来完成的。酸溶解曝光的铜，只留下电路图案。
    腐蚀完成后，剩余的干膜被去除，电路图案留在层压板表面上。然后再次清洁PCB，去除任何残留的腐蚀溶液或干膜残留物。
    在负片工艺流程中，步骤略有不同。不是应用干膜，而是使用光敏液体光阻。液体光阻被涂在层压板表面，然后通过光掩膜进行紫外线曝光。曝光区域的光阻聚合并变得不溶，而未曝光区域仍然可溶。xposed
    曝光后，使用显影溶液冲洗掉未曝光区域的光阻。曝光的铜区域现在受到硬化光阻的保护。
    下一步是在曝光的铜区域镀一层锡或其他保护金属。这是通过将PCB浸入电镀槽中完成的。槽中的金属离子被吸引到曝光的铜上，形成一层保护层。
    镀层完成后，光阻被去除，保留下保护的电路图案。然后清洁PCB，去除任何残留的电镀溶液或光阻残留物。

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