Translation without guarantee in the event of any doubt arising, the original standard in Japanese is
to be evidence.
JEITA standards are established independently to any existing patents on the products, materials or processes they cover.
JEITA assumes absolutely no responsibility toward parties applying these standards or toward patent owners.
©  2001 by the Japan Electronics and Information Technology Industries Association
All rights reserved. No part of this standards may be reproduced in any form or by any means
without prior permission in writing from the publisher.
CONTENTS
Page 1. SCOPE (1)
2. DEFINITION OF TERMS (1)
3. PRECAUTIONS (1)
4. TEST METHODS (1)
COMMENTS (3)
APPENDIX (9)
TEST METHOD 201 HIGH TEMPERATURE STORAGE (11)
TEST METHOD 202  LOW TEMPERATURE STORAGE (13)
TEST METHOD 203  MOISTURE RESISTANCE (CYCLIC) (15)
TEST METHOD 204  SALT MIST (21)
Standard of Japan Electronics and Information Technology Industries Association Environmental and endurance test methods for semiconductor devices
(Life test II)
1.SCOPE
These standards provide for environmental test methods and endurance test methods (especially life tests) aimed at evaluating the resistance and the endurance of discrete semiconductor devices and integrated circuits (hereinafter generically called semiconductor devices) used in electronic equipment mainly for general industrial applications and consumer applications, under the various environmental conditions of various kinds that occur during their use, storage and transportation.
2.DEFINITION OF TERMS
The definitions of the technical terms used in these standards and in the relevant specifications are given in EIAJ ED-4701/001 "Environmental and endurance test methods for semiconductor devices (General)."
3.PRECAUTIONS
The precautions used in these standards and in the relevant specifications are given in EIAJ ED-4701/001 "Environmental and endurance test methods for semiconductor devices (General)."
4.TEST METHODS
Refer to the Appendix for the test methods.
Remarks:
The various test methods are arranged independently for the sake of more convenient use of these standards.
COMMENTS
1.PURPOSE OF ESTABLISHMENT OF THESE STANDARDS
Before the establishment of these standards, the standardization referring to EIAJ ED-4701 "Environmental and endurance test methods for semiconductor devices" established on Feb., 1992, and EIAJ has issued amendments, whenever the revision and also new test method establish.
However, it is recondite where the latest test methods are entered, it was resulting the confusion of users. So establishment of new numbering system that is easy to use both users and manufacturers was decided, and reached to the issuance in this time.
Electronic Industries Association of Japan (EIAJ) and The Japan Electronic Industry Development Ass
ociation (JEIDA) have merged effective November 1,2000, the Japan Electronics and Information Technology Industries Association (JEITA).
2.EVOLUTION OF THE DELIBERATIONS
The revision of the standards and new numbering system have been deliberated by "Sub-Committee on Semiconductor Devices Reliability" of the Technical Standardization Committee on Semiconductor Devices/Semiconductor Devices Reliability Group from Apr., 2000. Though to issue as a separate standard every each test method was considered, it made to issue with the system like the following.
(a)EIAJ ED-4701/001Environmental and endurance test methods for semiconductor devices
(General)
(b)EIAJ ED-4701/100Environmental and endurance test methods for semiconductor devices
editor evaluating revision(Life test I)
101  Steady state operating life
102  Temperature humidity bias (THB)
103  Temperature humidity storage
104  Moisture soaking and soldering heat stress series test
105  Temperature cycle
106  Intermittent operating life
(c)EIAJ ED-4701/200Environmental and endurance test methods for semiconductor devices
(Life test II)
201  High temperature storage
202  Low temperature storage
203  Moisture resistance (Cyclic)
204  Salt mist
(d)EIAJ ED-4701/300Environmental and endurance test methods for semiconductor devices
(Stress test I)
301  Resistance to soldering heat for surface mounting devices (SMD)
302  Resistance to soldering heat (Excluding surface mounting devices)
303 Solderability
304  Human body model electrostatic discharge (HBM/ESD)

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