专利名称：ELECRTROLESS PLATING DEVICE 发明人：GOTO KENJI
reactive to
申请号：JP21935389
申请日：19890825
公开号：JPH0382770A
公开日：
19910408
专利内容由知识产权出版社提供
摘要：PURPOSE:To rapidly exhaust generated reactive gas from a vessel contg. an electroless plating soln. and to easily and surely form a nearly uniform plating layer even on the inside of each fine through hole by evacuating the internal space of the vessel with an evacuating means. CONSTITUTION:Printed circuit boards 3 as bodies to be plated are set in a basket 4, immersed in an electroless plating soln. 1 in a vessel 5 and electroless-plated. At this time, an evacuating means 6 composed of a lid 6a and a pipe 6b is fitted to the vessel 5 and the space 5a on the plating soln. 1 is evacuated with the means 6. Reactive gas generated during electroless plating is rapidly exhausted from the vessel 5 and the sticking and remaining of the gas on the bodies 3 to be plated are prevented. A nearly uniform plating layer can be formed even on the inside of each through hole of about <=0.4 mm diameter.
申请人：TOSHIBA CORP
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