专利名称：INTEGRATED TRANSLATIONAL LAND-GRID ARRAY SOCKETS AND LOADING
MECHANISMS FOR SEMICONDUCTIVE
DEVICES
发明人：AOKI, Russell S.,VALPIANI, Anthony P.,DALE, Barry T.,CHIU, Chia-Pin
申请号：US2011/067509
申请日：20111228
公开号：WO2012/108944A2
公开日：
20120816
专利内容由知识产权出版社提供
专利附图：
摘要：A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die package is inserted into the socket. After zero insertion-force assembly, the motion plate applies a force on the land-grid array contact that causes the contact tip to deflect in a positive-Z direction until a useful contact is made at the contact tip with a land-grid array pad.
申请人：INTEL CORPORATION,AOKI, Russell S.,VALPIANI, Anthony P.,DALE, Barry T.,CHIU, Chia-Pin
地址：95052 US,98407 US,98338 US,98327 US,85284 US
arduino字符串转数组国籍：US,US,US,US,US
代理人：VINCENT, Lester J. et al.
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