专利名称：Spring interconnect structures
发明人：Gaetan L. Mathieu,Benjamin N. Eldridge,Gary
W. Grube,Richard A. Larder
申请号：US12120112
申请日：20080513
公开号：US07553165B2
公开日：
20090630
专利内容由知识产权出版社提供
专利附图：
摘要：An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The
second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resi
lient element, the second contact region will contact the third contact region. The interconnection, in one aspect, is of a size suitable for directly contacting a semiconductor device. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The interconnection element, in another aspect, is of a size suitable for contacting a packaged semiconductor device, such as in an LGA package.
申请人：Gaetan L. Mathieu,Benjamin N. Eldridge,Gary W. Grube,Richard A. Larder
地址：Livermore CA US,Danville CA US,Pleasanton CA US,Livermore CA US
国籍：US,US,US,US
代理人：N. Kenneth Burraston
spring framework和spring的关系
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