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Keeping Cost per placement under control using 01005 components
Jeroen de Groot
Marketing Director Assembleon Asia
October 13
th
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Market of microchips (0201 and 01005 size)
Cellular phone
(Board of main body)
0201
Small video (DSC, DVC, etc.)
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Migration of microchips to modules
•Component distribution (source: Murata ):
–Now: 70 % of microchips on main board (30 % in modules)–Future (3-5 years from now): 60% of microchips in modules
•Reasons for this migration:
–Difficult to solder both microchips and large IC ’s at same board –Less RF specific competence needed
–Reduced investments at manufacturer of end-products
•Less specific production equipment necessary (wire bonders, FC placers, etc.)
–Shorter Time-to-market (TTM)
•Off-the-shelf functionality
–More flexibility in mobile phone design
•Diversity based on modular architecture
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Design
•Traces may have to pass around the component. Stencil printing
•Finer grain size of the solder particles in the solder paste •The risk of blocked stencil apertures and bridging
•The need for using even thinner stencils ( down to 50 µm)Inspection
•Visual inspection and will
become more difficult and repair is not possible
Challenges for ‘01005’ components
active alignmentSource: Philips CFT –February 2003
Component placement
•Required placement accuracy better than 50 micron (3 sigma)
•Special nozzle (with an extremely small nozzle diameter)
•Placement force is critical              (risk of component cracking)•High resolution vision camera •Positional accuracy of feeder and tape
•Measuring / correcting pick-up position Soldering
•Poor solder balling.
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‘01005’ process challenges
•‘01005’ chip size requires thinner stencils ( down to 50 µm ) and does not fit in existing reflow process for applications with mixed components. Extra process steps would be necessary and existing lines must be adapted accordingly.•‘01005’ components can be used in modules & System In
Package (SiP) applications where all the components are small •The available process window for lead free soldering of ‘01005’ is more critical. Due to higher temperatures the risk of flux evaporation is present.
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Parallel principle of operation

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