DXP封装库中英文对照
序号
库名称
元件
英文
图样
备注
1
Axial Lead Diode
二极管
DIO6.35-3.1x1.6
引脚间距6.35mm，矩形长3.1mm，宽1.6 mm
DIO20.5-10x5.8
引脚间距20.5mm，矩形长1mm，宽5.8mm
2
BGA - Rectangle
集成块
R-BGA8x11-B88
88脚球珊阵列封装IC
3
Bridge Rectifier
桥堆
E-BIP-P4/D10
e Rectifier; 4 Terminals; Body 9.4 x 9.4 mm (typ); Pitch 5.08 mm
E-BIP-P4/X1.8
Bridge Rectifier; 4 Terminals; Body 16.8 x 16.8 mm (typ); Pitch 10.67 mm
4
Bumpered QFP - Centre Index
集成块
B-QFP-G100/T
PQFP; 100 Leads; Body 19.1 x 19.1 mm; Pitch 0.635 mm四方扁平封装
5
CAN - Circle pin arrangement
2-12脚金属封装元件
CAN-2
Can; 2 Leads; Pin Circle Dia. 2.54 mm; Lead Dia. 0.48 mm (max)
CAN-3/D5.6
3 Leads; Pin Circle Dia. 2.54 mm; Lead Dia. 0.48 mm
CAN-8/D9.2
8 Leads; Pin Circle Dia. 5.08 mm; Lead Dia. 0.48 mm
6
Capacitor Electrolytic Snap-In
电解电容封装
CAPPRS10-22x20
Capacitor, Electrolytic, Radial, Snap-In Pins; Body 22 x 20 mm (Dia.xH typ); Pin Spacing 10 mm (typ)
7
Capacitor Non-Polar Axial
无极性电容
CAPA17.8-13x21
Capacitor, Ceramic, Thru-Hole, Axial Leads; Body 13 x 21 mm (LxDia. max) Pin Spacing 17.8 mm (typ)
8
Capacitor Non-Polar Dipped Radial
CAPR2.54-5.1x2.5
Capacitor, Ceramic, Thru-Hole, Dipped Radial; Body 5.1 x 2.5 mm (WxT) Pin Spacing 2.54 mm (typ)
CAPR5.08-5.1x2.5
Capacitor, Ceramic, Thru-Hole, Dipped Radial; Body 5.1 x 2.5 mm (WxT) Pin Spacing 5.08 mm (typ)
9
Capacitor Non-Polar Disc
CAPRD5-6.5x4.5
Capacitor, Ceramic, Thru-Hole, Disc; Body 6.5 x 4.5 mm (LxW max) Pin Spacing 5 mm (typ)
10
Capacitor Non-Polar Radial
CAPNR2-5X11
CAPNR5-5X11
11
Capacitor Polar Axial
CAPPA9.9-6.7X2.5
Capacitor, Axial, Polarised; Body 6.6 x 2.4 mm (LxDia. max), Lead Dia. 0.51 mm (typ)
12
Capacitor Polar Radial Cylinder
CAPPR5-8x5
Capacitor, Electrolytic, Radial; Body 8 x 5 mm (Dia.xH typ); Pin Spacing 5 mm (typ)
CAPPR5-6.3x7
13
Capacitor Tantalum Radial Oval
CAPNTO5.08-7.37x3.94
Capacitor, Radial, Tantalum, Non-Polarised; Body 7.37 x 3.94 x 6.86 mm (WxTxH max); Pin Spacing 5.08 mm (typ)
CAPNTO2.54-3.05x1.78A
14
CCGA - Square
CCGA35X35-B717
717-Pin Ceramic Column Grid Array Package 1.27mm Pitch (CG717)
15
Ceramic DFP
CDFP-G6
DFP; 6 Leads; Body 3.7 x 3.6 mm (LxW max); Pitch 1.27 mm
CDFP-G8/X.6
CDFP-G64
DFP;64 Leads; Body 19.4 x 11.3 mm; Pitch 0.5 mm
16
Ceramic QFP (Square)
四方扁平封装IC（正方形）
CQFP-G24
Quad Cerpak; 24 Leads; 10 x 10 mm; Pitch 1.27mm
CQFP-G68/X.4
QFP; 68 Leads; Body 12.5 x 12.5 mm; Pitch 0.635mm
17
Chip Capacitor - 2 Contacts
贴片电容
CC1310-0504
Chip Capacitor; Body 1.2 x 1.0 mm (LxW typ)
CC3825-1510
Chip Capacitor; Body 3.81 x 2.54 mm (LxW typ)
18
Chip Diode - 2 Contacts
贴片二极管
CD3216-1206
Chip Diode; Body 3.2 x 1.6 mm (LxW typ)
CD1310-0504
Chip Diode; Body 1.2 x 1.0 mm
19
Chip Inductor - 2 Contacts
贴片电感
INDC1608-0603
Chip Inductor; Body 1.6 x 0.8 mm (LxW typ)
INDC2115-0806
Chip Inductor; Body 2.1 x 1.5 mm (LxW typ)
20
Chip Resistor 2 Contacts
贴片电阻
CR0603-0201
Chip Resistor; Body 0.6 x 0.3 mm (LxW typ)
CR3216-1206
Chip Resistor; Body 3.2 x 1.6 mm
21
Con 050 DSubminiature
接口
050DSUB1.27-2H28B
Connector; D Subminiature 050 Series; 28 Position; Right Angle
22
Con Audio
耳塞接口
RCA/5.3-2H2
Two Conductor Jack (RCA), Right Angle, Thru-Hole, Body 10 x 12 x 13 mm (WxTxH)
JACK/6-V5
Connector; Jack Socket, 1/4" [6.5mm], Thru-Hole, 5 Position, Vertical, Body 15.7 x 15.7 x 31 mm (WxTxH)
23
Con CardEdge
CARD1.27-2V120
Connector; Card Edge .050 Series PCI; 2x60 Position; 32-Bit Bus
CARD/SM1.27-2V120
Connector; Card Edge .050 Series PCI; 2x60 Position; 32-Bit Bus
24
Con FPC-FFC
FFC/SM0.5-2H10
Connector; FH12 Series; 10 Position; 0.5mm Spaced Bottom Contact
25
Con Mains Power
电源插座
IEC7-2H3
     
Mains Power Outlet, IEC60 320-2-2 F, PC Flange Rear Mount
26
Con Mod Jack PCB
JACK/SM1.27-2H8H
Connector; PCB Jack, SMT; 1-Port, 8 Positions, 8 Loaded; Unshielded without Lightpipes; Right Angle
27
Con Rect Stag PCB
SIMM1.27-3V80
Connector; SIMM II; 80 Position; Vertical
28
Con RF Coaxial
MCX2.49-V5
 
Connector; RF Coaxial, MCX, SM; 5 Position; Vertical
MCX5.08-H5
Connector; RF Coaxial, MCX, Thru-Hole; 5 Position; Right-Angle
29
Con USB
USB接口
USB2.0-4H4
Connector; USB1.1, Type A, Thru-Hole; 4 Position; Right Angle
USB/SM0.8-6H5
USB2.0, Type B, SM; 5 Position; Right Angle
30
Crystal Oscillator
晶振
2SMX-3SMXB
Surface Mount Quartz Crystal; Body 6.2 x 3.7 mm
BCY-W2/E4.7
Thru-Hole; 2 Leads; 11.35 x 4.65 x 13.46 mm
BCY-W2/D3.1
Crystal, Thru-Hole; 2 Leads; Body 3.1 x 8.2 mm
BCY-W3/E5
Quartz Crystal, Thru-Hole; 3 Leads; 11.35 x 5 x 3.5
31
Cylinder with Flat Index
BCY-W2/D4.8
TO, Flat Index; 2 In-Line, Axial Leads; Body Dia. 4.6mm; Lead Dia. 0.5 mm
BCY-W3
TO, Flat Index; 3 In-Line, Axial Leads; Body Dia. 4.8mm; Leads 0.61 x 0.61
BCY-W3/B.8
3 In-Line, Axial Leads; Body Dia. 4.6mm; Lead Dia. 0.5 mm
BCY-W3/R1.27
3 Axial Leads; Pin Circle Dia. 2.54 mm; Body Dia. 4.6mm; Lead Dia. 0.48
32
Diamond BaseCAN
- 2 Leads
MBFM-P2/P7.25
Oval Flange Mount with (2) Offset Leads; Pin Spacing 10.93 mm; Lead Dia. 1.09 mm
33
DIP - LED Display
七段数码管
LEDDIP-10(14)
LED, 7-Segment Display; 10 Pins; Row Space 7.62 mm; Pitch 2.54 mm
LEDDIP-10/X1.65
10 Pins; Row Space 15.24 mm; Pitch 2.54 mm
34
DIP - Peg Leads
双列直插IC
DIP-P14
DIP; 14 Round Pins; Row Space 7.62 mm; Pitch 2.54 mm
35
DIP, Modified -Trimmed Leads
8-48脚双列贴片IC
S-DIP-8
DIP; 8 Trim Leads; Row Spacing 7.62 mm; Pitch 2.54 mm
36
D-PAK
SIP-G3/C7
D-PAK/TO-252-AA; 3 Leads (1 Cropped); Body 10.2mm
3 Leads (1 Cropped); Body 10.1  x 6.6
D2-PAK; 7 Leads; Body 14.4 (inc. leads) x 10.4 mm
SIP-G3/C7.4
SIP-G7/X.9
37
Dual-In-Line Package
标准双列直插封装IC
DIP-4
DIP; 4 Leads; Row Spacing 7.62 mm; Pitch 2.54 mm
DIP-40
40 Leads; 15.24 mm; Pitch 2.54 mm
DIP-8/D10.3
DIP; 8 Leads; 7.62 mm; Pitch 2.54 mm
DIP-8/D9.8
DIP; 8 Leads; 7.62 mm; Pitch 2.54 mm
38
Flange Mount with Rectangular Base
R-SFM-T3/X3.4
Rectangular Flange Mount, Thru-Hole; 3 Leads; Pitch 5.08 mm
39
FQFP- Rectangle
四方扁平封装IC（长方形）
FR-QFP5X7-G32/N
 
QFP; 32 Leads; 5 x 7 mm; Pitch 0.5
QFP; 264 Leads; Body 28 x 40 mm; Pitch 0.5 mm。
（R-QFP14x20-G64/N，同类型QFP）
FR-QFP28X40-G264/N
40
FQFP (Square) -Corner Index
四方扁平封装IC（正方形长脚）
F-QFP5x5-G48/N
 
QFP; 48 Leads; Body 5 x 5 mm; Pitch 0.3 mm
F-QFP20x20-G248/N
QFP; 248 Leads; Body 20 x 20 mm; Pitch 0.3 mm引脚间距有0.3、0.4、0.5三种，此种是0.3
41
Horizontal, Flange Mount with Tab
卧式散热器安装
DFM-T5/H
TO, Thru-Hole, Horizontal, Heatsink Mounted; 5 Bent Staggered Leads; Pitch 1.7 mm
DFM-T7/H
TO, Thru-Hole, Horizontal, Heatsink Mounted; 7 Bent Staggered Leads; Pitch 1.27 mm
42
Leaded ChipCarrier - Rectangle
长方形PLCC封装
R-QCC-J18
PLCC; 18 Leads; Body 7.2 x 10.8 mm; Pitch 1.27 mm
R-QCC-J32/Y2
Leaded Chip Carrier; 32 Leads; Body 11.4 x 14 mm
43
Leadless ChipCarrier-Square
正方形PLCC封装
QCC-J20/G6.1
Leaded Chip Carrier; 20 Leads; Body 9 x 9 mm
44
MELF- Diode
贴片二极管
MELF-D3512-1405
Metal Electrode Face (MELF) Diode; Body 3.5 x 1.5 mm
45
MELF- Resistor
贴片电阻封装
MELF-R2012-0805
polarised
Metal Electrode Face (MELF) Resistor; Body 2 x 1.4 mm
46
Miscellaneous Connector PCB
通用连接器件封装库
BNC_RA CON
HDR1X2
2.54×5.08mm，引脚间距2.54mm
HDR1X2H
2脚插座卧式安装
MHDR1X3
MHDR2X2
双排共4脚
PIN2
SMB_V-RJ45
复位开关
47
Miscellaneous Devices PCB
通用元器件封装库
AXIAL-0.4
0.3-1.0共8种
 
 
引脚间距400mil，100mil=2.54mm，所以0.4为2.54x4=10.16mm；
BAT-2
电源插座封装
CAPR5-4X5
磁介电容，间距5mm，圆直径4mm
DIODE-0.4
引脚间距10.16mm二极管封装
DIP-12/SW
双列直插IC
DIP_SW_8WAY_SMD
8个拨动开关
DPST-4
LED-0
放光二极管封装
LED-1
光电二极管封装
POT4MM-2
R2012-0805
0805贴片电阻封装
RAD-0.1
0.1-0.4四种，引脚间距从100-400mil，200×100mil
RB7.6-15
SMD _LED
SPST-2
SW-7
TRANS
变压器封装
VR2
VR2-VR5，电位器封装

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