1.Purpose
目的
Setting up a spec of PCB for memory module product.
制定内存产品规格.
2.Scope
范围
This spec is applied to the PCB for normal memory module product.
这规格应用于内存条产品.
3.Reference Document
参考文献
1>PCB working direction(HEI standard)
HEI标准PCB工作指引
2>JEDEC spec:JEDEC spec.M0-064
JEDEC标准:JEDEC spec.M0-064
3>IPC spec:IPC-A-600
IPC spec:IPC-A-600
4.Equipment & Materials:Not required
仪器和材料:不要求
5.Calibration:Not required
仪校:不要求
6.Records & Forms:Not required
记录和格式:不要求
7.Safety
安全性
1>Materials have to be stored in a appointed place.
产品必须储存在许可的地方.
2>It should be handled carefully for safety.
搬运必须考虑其产品的安全性.
8.Definition
定义
1>PCB:a composite of organic and inorganic material,with external and internal conducting or low-resistivity paths that allow mechanical support and electrical connection of components.(Printed Circuit Board)
印刷线路板
2>Tab:It connects electrical signal between memory module and system
金手指:连接记忆模块和系统间电子信号
accepted什么意思中文3>Via hole:An hole that provides an electrical pathway from one metal layer to the metal layer above or below
过孔:导通孔。用于印制板不同层中导线之间电气互连的一种镀覆孔。
4>Land:a circle copper which surrounds the via hole
孔环:过孔孔环-连接盘。
5>Solder Resist:Solder mask is applied to protect and insulate the circuitry both during subsequent soldering and in the environment
防焊阻剂:绿油
6>Discoloration:the change in color of any plated metallization.
变:金属化镀层差
7>Copper Island(Copper residue):Copper that exists out of circuit
残铜:线间弧岛残铜
8>Undercut:the lateral etching into a substrate under a resistant coating,as at the edge of a resist image(→overcut)
侧蚀(过蚀)
9>X-out:An inferior piece of PCB
报废PCS
10>X-out Marking:Marking with X on the bad piece to let operator and equipment notice
报废标记
11>Piece connection:Exchange a inferior piece of PCB to normal piece

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