IPC-TM-650
2018-May IPC Test Method Manual
A standard developed by IPC
英文版是2018年刚刚整理发行的最新版本，全文共计700多页，升级了较多的文件内容，同时，也取消并删除了很多章节。
中文版官方未正式发行，只是个别几个章节有翻译成中文。第三方发行的也较早，也只有书本扫描件，很多和最新的英文版章节对不上，只能做为参考资料。建议使用英文原版。
更多IPC文件参考：p
Test Methods Approved
SECTION 1.0 - 1.0 Reporting and Measurement Analysis Methods
TM 1.1C Introduction 1/03
TM 1.2A Calibration 1/03
TM 1.3A Ambient Conditions 1/03
TM 1.4A Reporting, General 1/03
TM 1.5A Reporting, Format 1/03
TM 1.6A
Numerical Reporting 1/03
TM 1.7A
Reporting, Invalid Test Results 1/03
TM 1.8A
Measurement Precision Estimation for Binary Data 1/03
Includes Calculator and User Guide
TM 1.9A
Measurement Precision Estimation for Variables Data 1/03
Includes Calculator and User Guide
SECTION 2.1 - 2.1 Visual Test Methods
TM 2.1.1F
Microsectioning, Manual and Semi or Automatic 6/15
TM 2.1.2A
Pinhole Evaluation, Dye Penetration Method 3/76
TM 2.1.3A
Plated-Through Hole Structure Evaluation 8/76
TM 2.1.5A
Surface Examination, Unclad and Metal-Clad Material 12/82 TM 2.1.6B
Thickness of Glass Fabric 12/94
profile中文翻译TM 2.1.6.1
Weight of Fabric Reinforcements 12/94
renumbered from 2.3.12
TM 2.1.7C
Thread Count of Glass Fabric 12/94
TM 2.1.7.1
Thread Count, Organic Fibers 12/87
TM 2.1.8B
Workmanship 12/94
TM 2.1.9
Surface Scratch Examination Metal-Clad Foil 5/86
TM 2.1.10A
Visual Inspection for Undissolved Dicyandiamide 12/94
TM 2.1.13B
Inspection for Voids in Flexible Printed Board Materials 5/12
SECTION 2.2 - 2.2 Dimensional Test Methods
TM 2.2.1A
Mechanical Dimensional Verification 8/97
TM 2.2.2B
Optical Dimensional Verification 8/97
TM 2.2.4C
Dimensional Stability, Flexible Dielectric Materials 5/98
TM 2.2.5A
Dimensional Inspections Using Microsections 8/97
TM 2.2.6A
Hole Size Measurement, Drilled 8/97
TM 2.2.7A
Hole Size Measurement, Plated 5/86
TM 2.2.12A
Thickness of Copper by Weight 3/76
TM 2.2.12.1
Overall Thickness and Profile Factor of Copper Foils Treated and Untreated 9/87
TM 2.2.12.2
Weight and Thickness of Copper Foils with Releasable Carriers 7/89 TM 2.2.12.3
Weight and Thickness Determination of Copper Foils With Etchable Carriers 7/89
Thickness, Plating in Holes, Microhm Method 1/83
TM 2.2.14
Solder Powder Particle Size Distribution - Screen Method for Types 1-4 1/95
TM 2.2.14.1
Solder Powder Particle Size Distribution - Measuring Microscope Method 1/95
TM 2.2.14.2
Solder Powder Particle Size Distribution - Optical Image Analyzer Method 1/95
TM 2.2.14.3
Determination of Maximum Solder Powder Particle Size 1/95
TM 2.2.17A
Surface Roughness and Profile of Metallic Foils (Contacting Stylus Technique) 2/01
TM 2.2.18
Determination of Thickness of Laminates by Mechanical Measurement 12/94
TM 2.2.18.1
Determination of Thickness of Metallic Clad Laminates, Cross-sectional 12/94
12/94
TM 2.2.20
Solder Paste Metal Content by Weight 1/95
TM 2.2.21
Planarity of Dielectrics for High Density Interconnection
(HDI)/Microvia Technology 11/98
SECTION 2.3 - 2.3 Chemical Test Methods
TM 2.3.1
Chemical Processing, Suitable Processing Material 4/73
TM 2.3.1.1B
Chemical Cleaning of Metal-Clad Laminate 5/86
TM 2.3.2G
Chemical Resistance of Flexible Printed Board Materials 12/07
TM 2.3.4B
Chemical Resistance, Marking Paints and Inks 8/87
TM 2.3.4.2A
Chemical Resistance of Laminates, Prepreg, and Coated Foil Products, by Solvent Exposure 12/94

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