Solution Corp.
ISSC
Integrated System Solutions Corporation
IS1621N Stereo Headset Layout Guide
Revision History
Date Revision Content Revised
By Version 03/02/2010 Release version Charles Huang    1.0
Solution Corp.
Basic
Width
limitation
Description
FR4 PCB
4-Layer Structure 略
1.First to request 50ohm impedance of PCB making specification with PCB vendor，Providing two sets of
reference parameters as following suggestion。
PCB MAKING SPECIFICATION-1
2.4 GHz top layer and bottom layer 50ΩRF Trace Width : 13 mil
Solder mask 0.4 mil
TOP  Cu+Plating 0.5 OZ / 1.6 mil
CORE1 7628  /  8 mil
METAL 1    1 OZ / 1.4 mil
CORE 2    10 mil
METAL 2    1 OZ / 1.4 mil
CORE3 7628  /  8 mil
BOTTOM  Cu+Plating 0.5 OZ / 1.6mil
Solder mask 0.4 mil
Final thickness31.6 mil = 0.8mm
Solution Corp.
PCB MAKING SPECIFICATION-2
2.4 GHz top layer and bottom layer 50Ω RF Trace Width : 6 mil
Solder mask 0.4 mil
TOP  Cu+Plating 0.5 OZ / 1.6 mil
CORE1 2116  /  4.3 mil
headset
METAL 1    1 OZ / 1.4 mil
CORE 2 8 mil
METAL 2    1 OZ / 1.4 mil
CORE3 2116  /  4.3 mil
BOTTOM  Cu+Plating 0.5 OZ / 1.6 mil
Solder mask 0.4 mil
Final thickness23.4 mil=0.6mm
Solution Corp.
Power
Width
limitation
Description
ADAP_IN_IC More Than
15mil
1.ADAP_IN_IC needs to add 1K ohm (R62) and ESD diode (D27) to ground.

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