简述阳图型ps版的制版工艺流程
    英文回答：
    Positive Photoresist Patterning Process for PCB Fabrication.
    Positive photoresist patterning is a crucial process in printed circuit board (PCB) fabrication, enabling the transfer of desired circuit patterns onto the copper surface of the board. The process involves several key steps, each requiring specific materials and techniques:
    1. Substrate Preparation: The first step involves preparing the copper surface of the PCB to ensure proper adhesion of the photoresist. This includes cleaning and roughening the surface to create a suitable topography for bonding.
    2. Photoresist Application: Liquid photoresist is applied to the copper surface using various methods such as spin coating, spraying, or screen printing. The thickness of the applied photoresist is controlled to achieve the desired circuit line widths.
    3. Soft Bake: The coated PCB is subjected to a soft bake process to remove solvents from the photoresist and enhance its adhesion to the copper surface. This process typically involves heating the PCB at moderate temperatures, ensuring complete solvent evaporation.
    4. Exposure and Development: The photoresist-coated PCB is exposed to ultraviolet (UV) light through a photomask containing the desired circuit pattern. The exposed areas of the photoresist undergo chemical changes that render them soluble in a developer solution. The unexposed areas remain intact, forming the protective mask for the copper etching process.
    5. Post Exposure Bake: After exposure, the PCB is subjected to a post-exposure bake process to further harden the exposed photoresist. This enhances the contrast between the exposed and unexposed areas, ensuring a clean and precise pattern after development.
    6. Development: The exposed PCB is immersed in a developer solution that selectively removes the soluble portions of the photoresist. This process reveals the desired circuit pat
tern on the copper surface.
    7. Hard Bake: The developed PCB undergoes a hard bake process to fully cure the photoresist and improve its resistance to subsequent etching and handling. This step enhances the stability and durability of the circuit pattern.
    8. Copper Etching: The exposed copper areas not protected by the photoresist mask are etched away using a suitable etchant solution. This process creates the desired circuit traces on the PCB.
    9. Photoresist Stripping: After copper etching, the remaining photoresist is removed using a photoresist stripper solution. This process leaves behind the clean and patterned copper circuitry on the PCB.
    中文回答：
    阳图型ps版制版工艺流程。
    阳图型ps版制版工艺是印刷电路板（PCB）制造中的关键工艺，使所需的电路图案能够转移到电路板的铜表面上。该工艺涉及几个关键步骤，每个步骤都需要特定的材料和技术：
    1. 基板准备，第一步包括准备PCB的铜表面，以确保光刻胶的正确粘附。这包括清洁和粗化表面，以创建适合粘合的地形。
    2. 光刻胶应用，使用旋涂、喷涂或丝网印刷等方法将液态光刻胶施加到铜表面上。控制施加的光刻胶的厚度以实现所需的电路线宽。
    3. 软烘烤，将涂覆的PCB进行软烘烤工艺，以去除光刻胶中的溶剂并增强其对铜表面的附着力。该工艺通常涉及在中等温度下加热PCB，确保完全蒸发溶剂。
    4. 曝光显影，将光刻胶涂层的PCB通过包含所需电路图案的光掩模暴露在紫外线（UV）下。光刻胶的曝光区域会发生化学变化，使其在显影液中可溶。未曝光的区域保持完整，形成铜蚀刻工艺的保护膜。
    5. 后曝光烘烤，曝光后，将PCB进行后曝光烘烤工艺，以进一步硬化曝光的光刻胶。这增强了曝光区域和未曝光区域之间的对比度，确保显影后获得清晰、精细的图案。
    6. 显影，将曝光的PCB浸入显影液中，选择性地去除光刻胶的可溶部分。该工艺揭示了铜表面上所需的电路图案。
    7. 硬烘烤，将显影的PCB进行硬烘烤工艺，以完全固化光刻胶并提高其对后续蚀刻和处理的耐受性。此步骤增强了电路图案的稳定性和耐用性。
    8. 铜蚀刻，不被光刻胶掩模保护的暴露铜区域使用合适的腐蚀剂溶液蚀刻掉。此工艺在PCB上创建所需的电路走线。
    9. 光刻胶剥离，铜蚀刻后，使用光刻胶剥离剂去除剩余的光刻胶。该工艺留下PCB上干净且有图案的铜电路。
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