专利名称：MANUFACTURE OF PRINTED WIRING BOARDxposed
发明人：KATADA MASAHIRO
申请号：JP9600891
申请日：19910426
公开号：JPH04326588A
公开日：
19921116
专利内容由知识产权出版社提供
摘要：PURPOSE:To deal with a SMT printed wiring board having high positional resolution, by selectively removing two layers of etching resist. CONSTITUTION:After a first mask film 4a put on a photosensitive dry film 3a is irradiated by an ultraviolet ray so as to make a specific pattern, a photosensitive dry film 3b is piled up and fixed through thermocompression. For solder resist ink printing, exposure and printing are carried out with a secondary mask film 4c having a circuit pattern of only a through-hole land 1c and a pad part out of an overall one of the mask film 4a. Unexposed parts of dry films 3a and 3b are removed and etching resists 5a and 5b are formed. Then, a bare part of copper is etched so as to form a wiring circuit 1b. Moreover, after only the resist 5a is removed, photosensitive solder ink 6 is applied over all, and the ink 6 on the resist 5a is removed. The ink 6 is hardened by ultraviolet rays and the remaining resist 5a is removed.
申请人：NEC TOYAMA LTD
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