Henkel
Electronics Assembly Solutions
Irvine,
California
Rancho Dominguez, California
electronic去掉ic是什么San Diego,
California
Ontario,
California
Hemel Hempstead, UK
Linton, UK
Tainan, Taiwan
Seoul, Korea Lianyungang,
China
Shanghai, China
Ipoh, Malaysia
Kuala Lumpur, Malaysia
Ecatepec de Morelos,
Mexico
Dublin, Ireland
Yantai,China
Isogo, Japan
Hokkaido,
Japan
Kakogawa, Japan
Atsugi, Japan Port Huron, Michigan
Olean, New York
Billerica,
Massachusetts
Westerlo,
Belgium
Scheemda,
Netherlands
Canton, Massachusetts
Salisbury, North Carolina
Sao Paulo, Brazil
City of Industry, California
Manaus, Brazil
ElEctronics Group of HEnkEl
Please see LT-5013 for Semiconductor Solutions Guide
aSSeMbly Market
SolutionS
Today’s electronics assembly market can be complex.
Your materials supplier partnership shouldn’t be. That’s why Henkel has researched, analyzed,
designed and formulated the most comprehensive range of advanced assembly materials available. We deliver unprecedented choice, convenience and, above all, a low-risk proposition to your business so that complexity is eliminated and performance is elevated. Any application that requires joining, bonding, adhering or protecting an electronic
assembly will benefit from the value-added solutions within Henkel’s unmatched technology toolbox.Our leading-edge materials are uniquely strengthened by the exceptional expertise of our people. Bringing together the industry’s best and brightest chemists, applications experts, sales professionals, technical support specialists, scientists and researchers all under the guidance of a
knowledgeable and dedicated management team, Henkel provides the depth of
experience and breadth of capability you need to get the job done. Our worldwide service, manufacturing, sales and product development network delivers the global footprint that enables your company’s competitiveness – regardless of your requirements or your locale.
Henkel’s successful history is only superseded by our promising future. Even as we have
commercialized ground-breaking formulations for modern electronics manufacture, we are diligently researching and developing materials technology that will make tomorrow’s products possible.
Potting Compounds
Conformal  Coatings
Photonic Component
and Assembly Materials
surface Mount Adhesives
semiconductor Molding Compounds
thermal Management Materials
Flip Chip-on-Board
Underfills
Liquid encapsulants
Dam and Fill
optoelectronics
Die Attach Adhesives
solder Materials
Low Pressure Moldings
Liquid encapsulants
Glob top silicone encapsulants
Gasketing Compounds CsP/BGA Underfills
Flip Chip in Package Underfills
electronic Molding
Compounds
Coating  Powders

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