reactive diluent专利名称：Low fuming phenolic resin prepreg and its manufacturing method
发明人：UMEMOTO SADATAKA，梅元 禎孝,TANAKA TAKAYUKI，田中 孝之,FURUKAWA YASUO，古河
康雄
申请号：JP特願平2-216723
申请日：19900817
公开号：JP特公平8-32817B2
公开日：
19960329
专利内容由知识产权出版社提供
摘要：PURPOSE:To reduce smoke generation and improve self-adhesiveness by impregnating a fibrous substrate with a specific resin compsn. and drying the impregnated substrate. CONSTITUTION:100 pts.wt. water-sol. or -distersible resol phenol resin, 3-15 pts.wt. polyacrylamide having a mol.wt. of 300000 or higher, 2.5-20 pts.wt. water- sol. or emulsified epoxy resin of a bisphenol A type, a phenol novolac type, or a urethane-modified type, and 2.5-15 pts.wt. inorg. filler comprising a fine particle silica and a superfine particle Al2O3 in a ratio of Al2O3 to SiO2 of 1/10-2/5 are compounded to give a resin compsn., which is converted into a homogeneous dispersion on a roll mill and diluted with a non-reactive diluent (e.g. water) to give a resin soln. having a solid content of 30-85wt.%. A fibrous substrate is impregnated with the resin soln., adjusted in the solid pick-up to 20-60wt.%, and dried with a hot air dryer.
申请人：TOHO RAYON KK，東邦レーヨン株式会社
地址：東京都中央区日本橋3丁目3番9号
国籍：JP
代理人：光来出 良彦
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