电路板专业词汇（N－Z）
N.C.数值控制.
Nail Head钉头.
Near IR近红外线.
Negative负片,钻尖的第一面外缘变窄.
Negative Etch-back反回蚀.
Negative Stencil负性感光膜.
Negative-Acting Resist负性作用之阻剂.
Network纲状元件.
Newton牛顿.
Newton Ring 牛顿环.
Newtonian Liquid牛顿流体.
Nick缺口.
N-Methyl Pyrrolidine (NMP)N-甲基四氢哔咯.
Noble Metal Paste贵金属印膏.
Node节点.
Nodule节瘤.
Nomencleature标示文字符号.
Nominal Cured Thickness标示厚度.
Non-Circular Land非圆形孔环焊垫.
Non-flammable非燃性.
Non-wetting不沾锡.
Normal Concentration (Strength)标准浓度,当量浓度.
Normal Distribution常态分布.
Novolac酯醛树脂.
Nucleation , Nucleating核化.
Numerical Control数值控制.
Nylon尼龙.
*****O*****
Occlusion吸藏.
Off-Contact架空.
Offset第一面大小不均.
OFHC(Oxyen Free High Conductivity)无氧高导电铜.
Ohm欧姆.
Oilcanning盖板弹动.
OLB(Outer Lead Bond)外引脚结合.
Oligomer寡聚物.
Omega Meter离子污染检测仪.
Omega Wave振荡波.
On-Contact Printing密贴式印刷.
Opaquer不透明剂,遮光剂.
Open Circuits断线.
Optical Comparater光学对比器(光学放大器.)
Optical Density光密度.
Optical Inspection光学检验.
Optical Instrument光学仪器.
Organic Solderability Preservatives (OSP)有机保焊剂.
Osmosis渗透.
Outgassing出气,吹气.
Outgrowth悬出,横出,侧出.
Output产出,输出.
Overflow溢流.
Overhang总悬空.
Overlap 钻尖点分离.
Overpotantial(Over voltage)过电位,过电压.
Oxidation氧化.
Oxygen Inhibitor氧化抑制剂.
Ozone Depletion臭氧层耗损.
*****P*****
Packaging封装,构装.
Pad焊垫,圆垫.
Pad Master圆垫底片.
Pads Only Board唯垫板.
Palladium钯.
Panel制程板.
Panel Plating全板镀铜.
Panel Process全板电镀法.
Paper Phenolic纸质酚醛树脂(板材).
Parting Agent脱膜剂.
Passivation钝化 ,钝化外理.
Passive Device (Component)被动组件(零件)
Paste膏,糊.
Pattern板面图形.
Pattern Plating线路电镀.
Pattern Process线路电镀法.
Peak Voltage峰值电压.
Peel Strength抗撕强度.
Periodic Reverse (PR) Current周期性反电流.
Peripheral周边附属设备.
Permeability透气性,导磁率.
Permittivity诱电率,透电率.
pH Value酸碱值.
Phase相.
Phase Diagram相图.
Phenolic酚醛树脂.
Photofugitive感光褪.
Photographic film感光成像之底片.
Photoinitiator感光启始剂.
Photomask光罩.
Photoplotter, Plotter光学绘图机.
Photoresist光阻.
Photoresist Chemical Machinning (Milling)光阻式化学(铣刻)加工.
Phototool底片.
Pick and Place拾取与放置.
Piezoelectric压电性.
Pin 插脚,插梢,插针.
Pin Grid Array (PGA)矩阵式针脚对装.
Pinhole针孔.
Pink Ring粉红圈.
Pitch跨距,脚距,垫距,线距.
Pits凹点.
Plain Weave平织.
Plasma电浆.
Plasticizers可塑剂,增塑剂.
Plated Through Hole镀通孔.
Platen热盘.
Plating镀.
Plotting标绘.
Plowing犁沟.
Plug插脚,塞柱.
Ply层,股.
Pneumatic Stretcher气动拉伸器.
Pogo Pin伸缩探针.
Point 钻尖.
Point Angle钻尖面.
Point Source Light点状光源.
Poise泊."粘滞度"单位=1dyne*sec/cm2.
Polar Solvent极性溶剂.
Polarity电极性.
Polarization分极,极化.
Polarizing Slot偏槽.
Polyester Films聚酯类薄片.
Polymer Thick Film (PTF)厚膜糊.
Polymerization聚合.
Polymide(PI)聚亚醯胺.
Popcorn Effect爆米花效应.
Porcelain瓷材,瓷面.
Porosity Test疏孔度试验.
Positive Acting Resist正性光阻剂.
Post Cure后续硬化,后烤.
Post Separation后期分离,事后公离.
Pot Life运用期,锅中寿命.
Potting铸封,模封.
Power Supply电源供应器.
Preform 预制品.
Preheat预热.
Prepreg胶片,树脂片.
Press Plate钢板.
Press-Fit Contact挤入式接触.
Pressure Foot 压力脚.
Pre-tinning预先沾锡.
Primary Image线路成像.
Print Through压透,过度挤压..
Probe探针.
Process Camera制程用照像机.
Process Window操作范围.
Production Master生产底片.
Profile轮廓,部面图,升温曲线图棱线.
Propagation传播.
Propagation Delay传播延迟.
Puddle Effect水坑效应.
Pull Away拉离.
Pulse Plating脉冲电镀法.
Pumice Powder 浮石粉.
Punch冲切.
Purge, Purging净空,净洗.
Purple Plague紫疫(金与铝的共化物层).
Pyrolysis热裂解,高温分解.
*****Q*****
Quad Flat Pack (QFP)方扁形封装体.
Qualification Agency资格认证机构.
Qualification Inspection资格检验.
Qualified Products List合格产品(供应者)名单.
Qualitative Analysis定性分析.
Quality Conformance Test Circuitry (Coupon)品质符合之试验线路(样板).
Quantitative Analysis定量分析.
Quench 淬火,骤冷.
Quick Disconnect快速接头.
Quill纬纱绕轴.
*****R*****
Rack 挂架.
Radial Lead放射状引脚.
Radio Frequency Interference (RFI)射频干扰.
Rake Angle抠角,耙角.
Rated Temperature, Voltage额定温度,额定电压.
Reactance电抗.
Real Estate底材面,基板面.
Real Time System 实时系统.
Reclaiming再生,再制.
Rediometer辐射计,光度计.
Reel to Reel卷轮(盘)式操作.
Reference Dimension参考尺度.
Reference Edge参考边缘.
Reflection反射.
Reflow Soldering重熔焊接,熔焊.
Refraction折射.
Refractive Index折射率.
Register Mark对准用标记.
Registration对准度.
Reinforcement补强物.
Rejection剔退,拒收.
Relamination(Re-Lam)多层板压合.
Relaxation松弛.缓和.
Relay继电器.
Release Agent, Release Sheets脱模剂,离模剂.
Reliability可靠度,可信度.
Relief Angle浮角.
Repair修理.
Resin Coated Copper Foil背胶铜箔.
Resin Content胶含量,树脂含量.
Resin Flow胶流量,树脂流量.
Resin Recession树脂下陷.
Resin Rich Area 多胶区,树脂丰富区.
Resin Smear胶(糊)渣.
Resin Starve Area缺胶区,树脂缺乏区.
Resist阻膜,阻剂.
Resistivity电阻系数,电阻率.
Resistor电阻器,电阻.
Resistor Drift电阻漂移.
Resistor Paste电阻印膏.
Resolution解像,解像度,分辨率.
Resolving Power解析(像)力,分辨力.
Reverse Current Cleaning反电流(电解)清洗.
Reverse Etchback反回蚀.
Reverse Image负片影像(阻剂).
Reverse Osmosis (RO)反(逆渗透).
Reversion反转,还原.
Revision修正版.改订版.
Rework(ing)重工,再加工.
Rhology流变学,流变性质.
Ribbon Cable圆线缆带.
Rigid-Flex Printed Board硬软合板.
Ring 套环.
Rinsing水洗,冲洗.
Ripple纹波(指整流器所输出电流中不稳定成分).
Rise Time上升时间.
Roadmap 线路与零件之布局图.
Robber辅助阴极.
Roller Coating辊轮涂布.
Roller Coating滚动涂布法.
Roller Cutter辊切机.
Roller Tinning辊锡法,滚锡法.
Rosin松香.
Rotary Dip Test摆动沾锡试验.
Routing切外型.
Runout偏转,累绩距差.
Rupture迸裂.
*****S*****
Sacrificial Protection牺牲性保护层.
Salt Spray Test盐雾试验.
Sand Blast喷砂.
Saponification皂化作用.
Saponifier皂化剂.
Satin Finish缎面处理.
Scaled Flow Test比例流量实验.
Schemetic Diagram电路概略图.
ScoringV型刻槽.
Scratch刮痕.
Screen Printing纲版印刷.
Screenability纲印能力.
Scrubber磨刷机,磨刷器.
Scum透明残膜.
Sealing封孔.
Secondary Side第二面 .
Seeding下种.
Selective Plating选择性电镀.
Self-Extinguishing自熄性.
Selvage布边.
Semi-Additive Process半加成制程.
Semi-Conductor半导体.
Sensitizing敏化.
Separable Component Part可分离式零件.
Separator Plate隔板, 钢板.
Sequential Lamination接续性压合法.
Sequestering Agent螯合剂.
Shadowing阴影,回蚀死角.
Shank钻针柄部.
Shear Strength 抗剪强度.
Shelf Life储龄.
Shield遮蔽.
Shore Hardness萧氏硬度.
Short短路.
Shoulder Angle肩斜角.
Shunt分路.
Side Wall侧壁.
Siemens电阻值.
Sigma (Standard Deviation)标准差.
Signal讯号.
Silane硅烷.
Silica Gel硅胶砂.
Silicon硅.
Silicone硅铜.
Silk Screen纲版印刷,丝纲印刷.
Silver Migration银迁移.
Silver Paste 银膏.
Single-In-Line Package(SIP)单边插脚封装体.
Sintering烧结.
Sizing上胶,上浆.
Sizing上浆处理.
Skin Effect集肤效应 (高频下,电流在传递时多集中在导体
表面,使得道线内部通过电流甚少, 造成内部导体
浪费,并也使得表面导体部分电阻升高.
Skip Printing, Skip Plating漏印,漏镀.
Skip Solder 缺锡, 漏焊.
Slashing浆经.
Sleeve Jint套接.
Sliver边丝,边余.
Slot, Slotting槽口.
Sludge于泥.
Slump塌散.
Slurry稠浆,悬浮浆.
Small Hole小孔.
Smear胶渣.
Smudging锡点沾污.
Snap-off弹回高度.
Socket插座.
Soft Contact轻触.
Soft Glass 软质玻璃(铅玻璃).
Solder焊锡.
Solder Ball锡球.
Solder Bridging锡桥.
Solder Bump 焊锡凸块.
Solder Column Package锡柱脚封装法.
Solder Connection焊接.
Solder Cost焊锡着层.
Solder Dam锡堤.
Solder Fillet填锡.
Solder Levelling喷锡,热风整平.
Solder Masking(S/M)防焊膜绿漆.
Solder Paste锡膏.
Solder Plug锡塞(柱).
Solder Preforms预焊料.
Solder Projection焊锡突点.
Solder Sag 焊锡垂流物.
Solder Side焊锡面.
Solder Spatter溅锡.
Solder Splash贱锡.
Solder Spread Test散锡试验.
Solder Webbing锡纲.
Solder Webbing锡纲.
Solder Wicking渗锡,焊锡之灯芯效应.
Solderability可焊性.
Soldering软焊,焊接.
Soldering Fluid, Soldering Oil助焊液,护焊油.
Solid Content固体含量,固形分.
Solidus Line固相线.
Spacing间距.
Span跨距.
Spark Over闪络.
Specific Heat 比热.
Specification (Spec)规范,规格.
Specimen样品,试样.
Spectrophotometry分光光度计检测法.
Spindle主轴,钻轴.
Spinning Coating自转涂布.
Splay斜钻孔.
Spray Coating喷着涂装.
Spur底片图形边缘突出.
Sputtering溅射.
Squeege刮刀.
Stagger Grid蹒跚格点.
Stalagometer滴管式表面张力计.
Stand-off Terminals直立型端子.
Starvation缺胶.
Static Eliminator静电消除器.
Steel Rule Die(钢)刀模.
Stencil版膜.
Step and Repeat逐次重复曝光.
Step Plating梯阶式镀层.
Step Tablet阶段式曝光表.
Stiffener补强条(板).
Stop Off防镀膜, 阻剂.
Strain变形,应变.
Strand绞(指由许多股单丝集束并旋扭而成的丝束).
Stray Current迷走电流, 散杂电流(在电镀槽系统中,其直流电
由整流器所提供,应在阳极板与被镀件之间的汇
电杆与槽体液体中流通,但有时少部分电流也可能会
从槽体本身或加热器上迷走,漏失).
Stress Corrosion应力腐蚀.
Stress Relief消除应力.
Strike预镀.
Stringing拖尾.
Stripline条线.
Stripper剥除液(器).
Substractive Process减成法.
Substrate底材.
Supper Solder超级焊锡.
Supported Hole(金属)支助通孔.
Surface Energy表面能.
Surface Insulation Resistance表面绝缘电阻.
Surface Mount Device 表面粘装组件.
Surface Mounting Technology (SMT)表面粘装技术.
Surface Resistivity表面电阻率.
Surface Speed钻针表面速度.
Surface Tension表面张力.
Surfactant表面润湿剂.
Surge突流,突压.
Swaged Lead压扁式引脚.
Swelling Agents, Sweller膨松剂.
Swimming 线路滑离.
Synthetic Resin合成树脂.
*****T*****
Tab接点,金手指.
Taber Abraser泰伯磨试器.
Tackiness粘着性, 粘手性.
Tape Automatic Bonding (TAB)卷带自动结合.
Tape Casting 带状铸材.
Tape Test撕胶带试验.
Tape Up Master原始手贴片.
Taped Components卷带式连载组件.
Taper Pin Gauge锥状孔规.
Tarnish污化.
Tarnish 污化, 污着.
Teflon铁氟龙(聚4氟乙烯).
Telegraphing浮印,隐印.
Temperature Profile温度曲线.
Template模板.
Tensile Strength抗拉强度.
Tensiomenter张力计.
Tenting盖孔法.
Terminal端子.
Terminal Clearance端子空环.
Tetra-Etch氟树脂蚀粗剂.
Tetrafunctional Resin四功能树脂.
Thermal Coefficient of Expansion (TCE)热膨胀系数.
Thermal Conductivity导热率.
Thermal Cycling热循环,热震荡.
tablet press punch and dieThermal Mismstch感热失谐.
Thermal Relief散热式镂空.
Thermal Via导热孔.
Thermal Zone感热区.
Thermocompression Bonding热压结合.
Thermocouple热电偶.
Thermode发热体.
Thermode Soldering热模焊接法.
Thermogravimetric Analysis, (TGA)热重分析法.
Thermomechanical Analysis (TMA)热机分析法.
Thermoplastic热塑性.
Thermosetting热固性.
Thermosonic Bonding热超音波结合.
Thermount聚醯胺短纤席材.
Thermo-Via导热孔.
Thick Film Circuit厚膜电路.
Thief辅助阳极.
Thin Copper Foil薄铜箔.
Thin Core薄基板.
Thin Film Technology薄膜技术.
Thin Small Outline Package(TSOP)薄小型绩体电路器.
Thinner调薄剂.
Thixotropy抗垂流性,摇变性.
Three Point Bending三点压弯试验.
Three-Layer Carrier三层式载体.
Threshold Limit Value (TLV)极限值.
Through Hole Mounting通孔插装.
Through Put物流量,物料通过量.
Throwing Power分布力.
Tie Bar分流条.
Tin Drift锡量漂飘失.
Tin Immersion浸镀锡.
Tin Pest锡疫(常见白金属锡为"β锡",当温度低于13.2℃
时则β锡将逐渐转变成粉末状灰"α锡"称为"锡疫".
Tin Whishers锡须.
Tinning热沾焊锡.
Tolerance公差.
Tombstoning墓碑效应.
Tooling Feature工具标示物.
Topography表面地形.
Torsion Strength抗扭强度.
Touch Up触修,简修.
Trace 线路,导线.
Traceability追溯性,可溯性.
Transducer转能器.
Transfer Bump移用式突块.
Transfer Laminatied Circuit转压式线路.
Transfer Soldering移焊法.
Transistor晶体管.
Translucency半透性.
Transmission Line传输线.
Transmittance透光率.
Treament, Treating含浸处理.
Treeing枝状镀物,镀须.
Trim修整, 精修.
Trim Line裁切线.
Trimming修整,修边.
True Position真位.
Tungsten钨
Tungsten Carbide碳化钨.
Turnkey System包办式系统.
Turret Solder Terminal塔立式焊接端子.
Twill Weave斜织法.
Twist板扭.
Two Layer Carrier两层式载体.
*****U*****
UL Symbol(UL.为Under-Writers 保俭业试验所标志.
Laboratories,INC)
Ultimate Tensile Strength (UTS)极限抗拉强度.
Ultra High Frequency (UHF)超高频率.
Ultra Violet Curing (UV Curing)紫外线硬化.
Ultrasonic Bonding超音波结合.
Ultrasonic Cleaning超音波清洗.
Ultrasonic Soldering超音波焊接.
Unbalanced Transmission Line非平衡式传输线.
Undercut, Undercutting侧蚀.
Underplate底镀层.
Universal Tester汛用型电测机.
Unsupported Hole非镀通孔.
Urea尿素.
Urethane胺基甲酸乙脂.
*****V*****
Vacuoles焊洞.
Vacuum Evaporation(or Deposition)真空蒸镀法.
Vacuum Lamination真空压合.
Van Der Waals Force凡得华力.
Vapor Blasting蒸汽喷砂.
Vapor Degreasing蒸汽除油法.
Vapor Phase Soldering气相焊接.
Varnish凡力水,清漆(树脂之液态单体).
V-cutV型切槽.
Very Large-Scale Integration(VLSI)极大绩体电路器.
Via Hole 导通孔.
Vickers Hardness维氏硬度.
Viscosity粘滞度,粘度.
Vision Systems视觉系统.
Visual Examination目视检验.
Void 破洞,空洞.
Volatile Content挥发份含量.
Voltage电压.
Voltage Breakdown崩溃电压.
Voltage Drop 电压降落.
Voltage Efficiency电压效率.
Voltage Plane电压层.
Voltage Plane Clearance电压层的空环.
Volume Resistivity体绩电阻率.
Volume Resistivity体绩电阻率.
Volumetric Analysis容量分析法.
Vulcanization交联,硫化.
*****W*****
Wafer晶圆.
Waive暂准过关,暂不检查.
Warp Size 浆经处理.
Warp, Warpage板弯.
Washer垫圈.
Waste Treatment废弃处理.
Water Absorption吸水性.
Water Break水膜破散,水破.
Water Mark水印.
Watt瓦特.
Watts Bath瓦兹镀镍液.
Wave Guide导波管.
Wave Soldering波焊.
Waviness 波纹,波度.
Wear Resistance耐磨性,耐磨度.
Weatherability耐候性.
Weave Eposure织纹显露.
Weave Texture织纹隐现.
Web蹼部.
Wedge Bond 楔形结合点.
Wedge Void楔形缺口(破口).
Weft Yarn纬纱.
Welding熔接.
Wet Blasting湿喷砂.
Wet Lamination湿压膜法.
Wet Process湿式制程.
Wetting Agent润湿剂.
Wetting Balance沾锡天平.
Wetting Balance沾锡,沾湿.
Whirl Brush旋涡式磨刷法.
Whirl Coating旋涡涂布法.
Whisker晶须.
White Residue白残渣.
White Spot白点.
Wicking灯蕊效应.
Window操作范围,传动齿孔.
Wiping Action 滑动接触(导电).
Wire Bonding打线结合.
Wire Gauge线规.
Wire Lead金属线脚.
Wire Pattern布线图形.
Wire Wrap绕线互连.
Working Master工作母片.
Working Time (Life)堪用时间.
Workmanship 手艺,工艺水平,制作水准.
Woven Cable扁平编线.
Wrinkle皱折, 皱纹.
Wrought Foil锻碾金属箔.
*****X*****
X AxisX轴.
X-Ray X光.
X-Ray FluorescenceX萤光.
*****Y*****
Yarn纱线.
Y-AxisY轴.
Yield良品率,良率,产率.
Yield Point屈服点.
*****Z*****
Z-AxisZ轴.
Zero Centering中心不变(叠合法).
Zig-Zag In-Line Package (ZIP)炼齿状双排脚封装件.

版权声明：本站内容均来自互联网，仅供演示用，请勿用于商业和其他非法用途。如果侵犯了您的权益请与我们联系QQ:729038198，我们将在24小时内删除。