专利名称：VACUUM SUCTION BLOCK 发明人：HATSUSE TOSHIKAZU
申请号：JP9161784
申请日：19840508
公开号：JPS60238246A
公开日：
19851127
专利内容由知识产权出版社提供
摘要：PURPOSE:To make highly accurateness securable without entailing any influence of thermal or humid deformation, etc., by burning and forming a suction block with a porous material base block and an outer edge part being homogeneous to a laminated, nonporous material thin layer and then installing plural grooves or holes reaching to the base block. CONSTITUTION:After a base block 13 having a proper amount of porosity and a top suction part 12 consisting of a nonporous material thin layer having airtightness as well as an outer edge part 14 are solidly burnt, grooves or holes are formed so as to be reached to the base block 13 upon being adjusted to a suction work, and furthermore the top is accurately polished up so as to cause it to be flattened. And, when suction air tekes place by a suctin device, air inside a vacuum suction block 11 is drawn in by suction at grooves 16-18 via an air leading hole 19 so that a wafer 10 is attracted to the top suction part 12 with uniform power and locked thereat, and when polishing is over, the suction device is stopped, releasing the suction of the wafer 10. Next, when cleaning water is fed, it is pressed into the inside of the vacuum suction block 11 from these grooves 16-18 via the air leading hole 19, floating up the wafer 10 from the suction part 12 through grooves or holes 12a and making it easy to separate, and simultaneously swarf or dust in these grooves or holes is washed clean.
block truncated申请人：CITIZEN TOKEI KK 更多信息请下载全文后查看

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