专利名称：Spring structure and method
发明人：Fork, David K.,Ho, Jackson H.,Lau, Rachel
King-Ha,Lu, Jeng Ping
申请号：EP01305899.5
申请日：20010709
公开号：EP1176635A2
公开日：springframework和springboot
20020130
专利内容由知识产权出版社提供
专利附图：
摘要：Efficient methods for lithographically fabricating spring structures onto a substrate (301) containing contact pads or metal vias (305) by forming both the spring metal and release material layer
s using a single mask. Specifically, a pad of release
material (310) is self-aligned to the spring metal finger (320) using a photoresist mask or a plated metal pattern, or using lift-off processing techniques. A release mask is then used to release the spring metal finger while retaining a portion of the release material that secures the anchor portion of the spring metal finger to the substrate. When the release material is electrically conductive (e.g., titanium), this release material portion is positioned directly over the contact pad or metal via, and acts as a conduit to the spring metal finger in the completed spring structure. When the release material is non-conductive, a metal strap is formed to connect the spring metal finger to the contact pad or metal via, and also to further anchor the spring metal finger to the substrate.
申请人：Xerox Corporation
地址：Xerox Square - 20A, 100 Clinton Avenue South Rochester, New York 14644 US 国籍：US
代理机构：Skone James, Robert Edmund
更多信息请下载全文后查看

版权声明：本站内容均来自互联网，仅供演示用，请勿用于商业和其他非法用途。如果侵犯了您的权益请与我们联系QQ:729038198，我们将在24小时内删除。