A  a
A.O.I(Automatic Optical Inspection)自动光学检查Apparatus设备，仪器Acceptable quality level (AQL)可接受质量水平Area面积Accuracy精确度Artwork菲林Activating活化Artwork Drawing菲林图形Active carbon treatment活性碳处理Artwork Film原装菲林After Pressed Thickness压板后之厚度Artwork Modification菲林修改Alignment校直，结盟Artwork No.菲林编号Annular ring锡圈Assembly组装，装配Anti-Static Bag静电胶袋Axis轴
B  b
Backplane背板Blistering起泡/水泡Back-up垫板Board Cutting开料
Baking 烘板Board Thickness板厚
Ball Grid Array (BGA)球栅阵列Bottom side底层
Bare board裸板Breakaway tab打断点
Base Copper底铜Brushing磨刷
Base material基材Build-up积层Bevelling斜边Bullet pad子弹盘
Black Oxide黑氧化Buried hole埋孔
Blind via hole盲孔
C  c
C/M(Component Marking)元件字符Conductor width/space导体线宽/线隙Carbon ink碳油Contact接点
Carrier带板Copper area铜面积Ceramic substrate陶瓷Copper clad铜箔Certificate of Compliance合格证书Copper foil铜箔Chamfer倒角Copper plating电镀铜Chemical cleaning化学清洗Corner角线Chemical corrosion化学腐蚀Corner mark板角记号Chip Scale Package (CSP)晶片比例包装Corner REG.Hole角位对位孔Circuit线路Cracking裂缝Clearance间距/间隙Creasing皱折
Color颜Criteria规格，标准Component Side(C/S)元件面Crossection area切面Composite layers复合层Cu/Sn Plating镀铜锡Computer Aided Design (CAD)电脑辅助设计Current efficiency电流效率Computer Aided Manufacturing (CAM)电脑辅助制作Customer客户Computer Numerial Control (CNC)数控Customer Drilling File客户钻孔资料Conductor导体Customer P/N客户产品编号D  d
D/F Registration Hole干菲林对位孔Diamond钻石
D/F(Dry Film)干膜Diazo film重氮片
Date Code日期代号Dielectric breakdown介电击穿Datum hole基准参考孔Dielectric constant介电常数Daughter board子板Dielectric Thickness介电层厚度Deburring去毛刺Dielectric Voltage Test绝缘测试Defect缺陷Dimension尺寸Definition定义Dimensional stability尺寸稳定性Delamination分层Direct/indirect直接/间接Delay耽搁Distribution发放Delivery交货Document type文件种类Densitomefer透光度计Documentation Control文件控制
Density密度Double sided board双面板Department部门Drill bit钻咀Description说明Drilling钻孔
Design origin设计原点Drilling Roughness钻孔粗糙度Desmear去钻污，除胶Dry Film 干菲林Dessicant防潮珠Dry Film-Pattern干膜线路Developer显影液，显影机Dynamic动态
E  e
ECN(Engineering Change Notification)工程更改通知Entek有机涂覆Effective date有效期Epoxy glass substrate环氧玻璃基板Electrical Test Fixture电测试 针床Epoxy resin环氧基树脂Electro migration漏电Etch蚀刻Electroconductive paste导电胶Etchback凹蚀Electroless无电沉Etching蚀刻Electroless copper无电沉铜E-Test Marking电测试标记Electroless Ni无电沉镍E-Test(Electrical Test)电测试Electroless Gold/Au无电沉金Exposure曝光Engineering drawing工程图纸External layer外层
F  f
Fiducial mark基准点Fixture夹具
Filling填充Flammability可燃性
Film Fabrication菲林制作Flash Gold薄金
Final QC最终检查Flexible易曲的，能变形的Finish Overall Board Thickness成品总板厚度Flux助焊剂
G  gactive alignment
General information一般资料Golden board金板
Ghost image重影Grid网格
Glass transition temperature玻璃化湿度Ground plane地线层
Gold Finger(G/F)金手指
H  h
HAL(Hot Air Leveling)热风整平Hole density孔的密度
Hand Rout手锣Hole Diameter孔径
Hardness硬度Hole location孔位
Heat Sealed热密封Hole Location Chart孔位座标表Heat Shrink-warp热收缩Hole Position Tolerance孔位误差Holding time停留时间Hole size孔尺寸
Hole孔Hot Air Leveling(HAL)热风整平
Hole breakout破环Humidity湿度
I
Identification标识，指标Inter Plane Separation内层分离Image影像Interleave Paper隔纸
Imaging transfer图形转移Internal layer内层Impedance阻抗Internal stress内应力Impedance Test阻抗测试Ionic cleanliness离子清洁度Inner copper foil 内层铜箔Isolation孤立Inspection检验Isolation Resistance绝缘电阻Insulation resistance Test绝缘测试Item项目
K  k
KEY board按键盘Kraft paper牛皮纸
Key slot槽孔
L    l
Laminate板材Legend Width字符宽度Laminate Thickness材料厚度Length长度Lamination void 层间空洞Lifted Lands残铜Landless hole破孔Line Width线宽Laser plotter激光绘图机Liquid液体Laser plotting激光绘图Location位置Laser via hole激光穿孔Logic diagram逻辑图形Layup层压配本Logo唛头，标记Lay-up Instruction压板指示Lot size批卡Legend字符
M  m
Mark标记Min. Nickel Thickness最小镍厚
Master drawing菲林图形Min. Tin-Lead Thickness (After HAL)（喷锡后）最小
锡厚
Material Thickness材料厚度Min.Annular Ring最小环宽
Material Type材料类型Min.Spacing between Line to Line线与线之间的最
小距离
Max. X-out坏板上限Min.Spacing between Line to Pad线与焊盘之间的
最小距离
Max.Board Thickness After Plating电镀后总板
厚度之上限Min.Spacing between Pad to Pad焊盘与焊盘之间
的最小距离
Measling白斑Minimum 最小
Mech Drawing No.图纸编号Mirroring镜像Mechanical cleaning机械清洗Missing 缺少
Metal金属Model No.产品名称Method方法Molded模塑
MI(Manufacturing Instruction)生产制作指示Mother board主板Microstrip微条线Moulding模房
Min Conductor Copper Thickness最小线路铜厚Mounting hole安装孔
Min Hole Wall Copper Thickness最小孔壁铜厚Multilayer多层板
Min. Gold Plating Thickness最小金厚Multi-layer Laminate多层板材料
N  n
Negative反面的No.of Panel per Stack每叠板数
Net list网络表No.of Panel/Sheet每张大料拼板数Network网络No.of Pcs Per Bag每包数量
Nick缺口No.of Unit/Array每套单元数No. of holes孔数Normal value标准值
No.of Array/Panel每个拼板套板数
O  o
Oblong椭圆形的Organic Solerability Peservatives(OSP)有机保护剂Offset 偏移Originator原作者
Open/short开路/短路Outer copper foil外层铜箔Optimization(design)最佳化(设计)Outline外形
P  p
Packing包装Pitch间距
Packing包装Placement放置
Pad焊盘Plated Though Hole(PTH)沉铜
Panel Area拼板面积Plating电镀
Panel Plated Crack板镀缺口Plating Crack电镀裂缝Panel plating整板电镀Plating line电镀线
Panel Size拼板尺寸Plating rack电镀架
Panel Size After Outerlayer Cutting外层切板后拼板尺寸Plating Void电镀针孔Panel Utilization拼板利用率Plug Hole塞孔
Pass rate通过率Polymer聚合体Passivation钝化Porosity孔隙率
Pattern线路Positive绝对的
Pattern Inspection线路检查Power plane电源层
Pattern plating图形电镀Prepreg半固化片
PCB(Printed Circuit Board)印制线路板Primary side首面
Peck drilling啄钻Print印刷
Peel strength 剥离强度Probe point针床测点Peelable可剥性Process工序
Peelable  剥离强度Process flow工序流程Peelable Mask可脱油Product Planning Dept.生产计划部Peeling剥离Production生产板Permanent永久性Profile外形
PH value PH值Profiling  外形加工Photo plotting图形输出Profiling Process外形加工Photo via hole菲林过孔Project No.产品编号Photographers照片靶标PTH Thermal Seress Test PTH热冲击测试Photoplotler光绘机PTH(Plating Through Hole)沉铜
Physical物理的Pull away拉离
Pin hole销定孔Punch啤模
Pink ring粉红环Punching冲切
Pinning hole钻孔管位Punching Mould Drawing啤模图形
Q  q
QA Audit品质审计Quality质量
QA(Quanlity Assurance)品质部Quantity数量
Quad Palt Pack (QFP)四边扁平林整器件
R  r
Raw Material Utilization原材料利用率Resist抗蚀剂
Recall回收Resolution分辨率Rectifier整流器Rigid精密的Register mark对位点Roller coating涂覆Registration重合点Roughening粗化
Remark备注Round pad圆盘
Resin树脂Routing外形加工，铣板Resin Recession流胶
S  s
S/M Material绿油物料Solder mask on bare copper (smobc)裸铜覆盖阻焊膜S/M(Solder Mask)阻焊Solder side焊接面
Sales 销售Solder Side C/M阻焊面字符Sample样板Solder Side Cir.焊接面线路Sampling inspection抽样检验Solder Side Circuit焊接面Scaling factor缩放比例因素Solder Side S/M焊接面阻焊Scope范围Solderability可焊性Scoring刻槽Solvent Test可溶性测试Scratch划痕Spacing线距Secondary side第二面Special requirement 特殊要求Section Code组别代号Specification详细说明，规范Section Code Change组别代号更改Spindle主轴
Segment部分，片段Split裂片Separated分离Square pad方块Sequence顺序Standard标准值
Sets套Static静态
Sheet Size大料尺寸Stencial网版Shematic diagram原理图Step drilling分布钻
Shiny有光泽的，发光的Step scale光梯尺
Silk screen丝印Store货仓
Silver film银盐片Supplier供应商
Single/double单层/双面Supported hole支撑点
Slot  槽，坑Surface表面
Smear污点Surface mount technology表面组装技术Solder Mask阻焊Swimming滑移
T  t
Tack堆起Thermal stress热应力
Tape Programming铬带制作Thickness厚度
Tape Test胶带测试Tin Content锡含量
Target Hole目标孔Tin/Lead Stripping退铅锡Teardrop 泪珠Tin-lead plating电镀铅锡Template天平Tolerance公差
Tenting封孔Top side板面
Test测试Touch up修理(执漏) Test coupon图样Training训练
Test Parameter测试参数Transmission传输线
Test Pattern测试孔Transmittance传送
Testing Voltage电压Trim line修剪
Thermal shock热冲击
U  u
Ultrasonic cleaning超声波清洗Unit Layout Per Panel单元拼板图Undercut侧蚀Uv-blocking 阻挡紫外线Unit Arrangement单元排版
V  v
Vacunm Pack真空包装Visual & Warpage可视性和翘曲度Vacuum lamination真空压制Visual inspection目检
V-Cut V- 坑Voltage 电压
View From…观察方向由…
W  w
W/F(Wet Film)湿膜Width宽度
Warp & Twist翘曲和弯曲Wiring线路

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