覆晶技术（Flip-Chip）介绍
Available Flip Chip Tutorials
Tutorial 1. Introduction to Flip Chip
Tutorial 2. Solder Bump Flip Chip
Tutorial 3. Stud Bump Flip Chip
Tutorial 4. Polymer Bump Flip Chip
Tutorial 5. Anisotropic Conductive Film (ACF)Flip Chip
Tutorial 6. A Brief History of Flipped Chips
Tutorial 7. Electroless Nickel-Gold Flip Chip
Tutorial 8. Reworking Underfilled Flip Chip
Tutorial 9. Thermosonic Flip Chip Assembly
Tutorial 10. Flip Chip Interconnection for Detector Arrays
Tutorial 11. Under Bump Metallization (UBM)
Tutorial 12. Solder Bumping Step by Step
Tutorial 14. Bonding Edge Emitting Laser Diodes Using Gold/Tin Preforms Tutorial 15. Substrates for Flip Chip
Tutorial 16. Packaging, Handling, and Storing of Solder Spheres
Tutorial 17. SOC, SOP, and WLSCP
Tutorial 18. Fluxing for Flip Chip
Tutorial 20. Causes of Misalignment
Tutorial 21. Probing Bumped Flip Chips
Tutorial 22. Controlling Stress in Thin Films
Tutorial 23. Reworking Anisotropic Conductive Film (ACF) Flip Chip Assemblies
Tutorial 24. Gold Stud Bump Applications
Tutorial 25. Low Temperature Flip Chip for Flexible Displays
Tutorial 26. The Coming of Copper UBM
Tutorial 27. Shaping Gold Ball Bumps
Tutorial 28. Copper Bumps for Flip Chip Assembly
Tutorial 29. Micro-Posts: Tall, Slender, Stud Bumps.
Tutorial 30. Measuring thin films by spectral reflectance, Part 1
Tutorial 31. Wafer level hermetic cavity chip scale packages for RF
Tutorial 32. Gold Stud Bumping - the Other Flip-Chip Process
Tutorial 33. Conductive Polymer Assembly of High Pin Count Flip Chip Tutorial 34. Sputtered nickel UBM for lead-free solder bumping
Tutorial 35. Measuring thin films by spectral reflectance, Part 2
Tutorial 36. MEMS Special Packaging Needs
Tutorial 37. Too much gold can be a bad thing.
Tutorial 38. Evaporated Indium Bumps for Flip Chip
Tutorial 39. Electromigration and Thermomigration in Flip Chip Solder Joints Tutorial 40. Nano-embossing reaches production.
Tutorial 41. Hermeticity: much to do about nothing.
Tutorial 42. Evaluating Wafer Level Solder Reflow Options to Maximize Yield Tutorial 43. Wafer-level Hermetic Cavity Packaging.
Tutorial 44. Advanced Wafer-level Cleaning Method.
Tutorial 45. Lead-Free Facts and Myths.
Tutorial 46. Alloy Electroplating: The best solution for Au-Sn solder?
Tutorial 47. Flip Chip Bonder for Assembling 3D MEMS
Tutorial 48. Drop-in Lead-free solder
Tutorial 49. Wafer-level Nano-optics
Tutorial 50. Gold Stud Bump Update
Tutorial 51. Solder Bumping Single Die
Tutorial 52. New Generation Nano-Imprint Lithography System Tutorial 53. Probe testing differences in lead-free bumps
Tutorial 54. Nano Particle Adhesives
Tutorial 55. The Promise of C4NP
Tutorial 56. Injection Molding Solder Bumps
Tutorial 57. Thermosonic Bonding of 1,000-bump Flip Chips
Tutorial 58. Nanosoldering electronic components at room temperature Tutorial 59. Lower temperature lead-free flip chip
Tutorial 60. Nanotube Heat Sinks
Tutorial 61. Lead-Free Solder Bumping Methods
Tutorial 62. Vapor Jet Deposition of Multi-Metal Films
depositionTutorial 63. C4NP Test Data
Tutorial 64. Silver Nano-platelet Precursors for Ultra-Thin Conductors Tutorial 65. Cleaning microelectronic devices by Vacuum Cavitational Streaming
Tutorial 66. The Folly of RoHS
Tutorial 67. Underfilling Processes
Tutorial 68. Plasma pretreatment of Flip Chip and CSP assemblies Tutorial 69. Resonance Sensor Technology for Bump Inspection
Tutorial 70. Controlled-expansion substrates for WLP Tutorial 71. Nailing ICs Together
Tutorial 72. Redistribution Layers
Tutorial 73. Advanced Rework
Tutorial 74. High Conductivity Nickel-Fiber ACF Tutorial 75. Unique Polished Polyimide Substrate Tutorial 76. Jet Dispensing of Underfills
Tutorial 77. Solderless Copper Assembly
Tutorial 78. Quilt Packaging
Tutorial 79. Bump Cooling
Tutorial 80. Nano-particle Solder Paste
Tutorial 81. Wafer-level CSP with Integrated Passives Tutorial 82. Putting Photons on the Chip
Tutorial 83. Soldering Stud Bumps
Tutorial 84. Avoiding Lead-Free Brittle Fractures Tutorial 85. Chip to Wafer Hermetic Cavity Sealing Tutorial 86. 3D Silicon Chips
Tutorial 87. Laminated Chip Packages
Tutorial 88. ElectroChemical Pattern Replication

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